DLPC230S-Q1
DLP® automotive functional safety DMD controller for DLP553x-Q1 chipset
DLPC230S-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 2: –40°C to +105°C ambient operating temperature
- Device HBM ESD classification level 2
- Device CDM ESD classification level C4B
- Functional Safety Quality-Managed
- Documentation available to aid ISO 26262 functional safety system design up to ASIL-B
- DMD display controller supporting:
- DLP553xS-Q1 and DLP462xS-Q1 automotive interior display chipsets
- Video processing
- Scales input image to match DMD resolution
- Bezel adjustment up ±50% vertical image position and ±10% horizontal reducing the need for mechanical alignment (HUD)
- Support for pixel doubling or quadrupling to allow low resolution video input
- Gamma correction
- Embedded processor with error correction (ECC)
- On-chip diagnostic and self-test capability
- System diagnostics including temperature monitoring, device interface monitoring, and photodiode monitoring
- Integrated management of smooth dimming
- Configurable GPIO
- No external RAM required, internal SRAM for image processing
- 600MHz SubLVDS DMD interface for low power and emission
- Spread spectrum clocking for reduced EMI
- Video input interface
- Single OpenLDI (FPD-Link I) port up to 110MHz
- 24-bit RGB parallel interface up to 110MHz
- Configurable host control interface
- Serial peripheral interface (SPI) 10MHz
- I2C (400kHz)
- Host IRQ signal to provide real-time feedback for critical system errors
- Interface to TPS99000S-Q1 system management and illumination controller
The DLPC23xS-Q1 digital micromirror device (DMD) Controller for automotive applications is used in chipsets for interior and exterior display applications with a functional safety requirement (such as augmented reality HUDs and windshield clusters). The DLP5530S-Q1 chipset includes a 0.55” DMD and the DLP4620S-Q1 chipset includes a 0.46" DMD. Both chipsets also include the TPS99000S-Q1 System Management and Illumination controller. The DLPC23xS-Q1 integrates an embedded processor with error code correction (SECDED ECC), enabling host control and real-time feedback, on-chip diagnostics, and system monitoring functions. On-chip SRAM is included to remove the need for external DRAM. Combined with the TPS99000S-Q1, the DLPC23xS-Q1 supports high dynamic range dimming of over 5000:1 for HUD applications. SubLVDS 600MHz DMD interface allows high DMD refresh rates to generate seamless and brilliant digital images, while simultaneously reducing radiated emissions.
To aid in the design and manufacture of automotive qualified projectors based on DLP technology, there are a number of established optical module manufacturers and design houses that can be leveraged to support your design.
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Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | DLPC23xS-Q1 Automotive Digital Micromirror Device Controller datasheet (Rev. E) | PDF | HTML | 20 Aug 2024 |
User guide | DLPC230-Q1, DLPC230S-Q1 Programmer's Guide for Display Applications (Rev. G) | PDF | HTML | 18 Jul 2024 | |
Application note | Estimating Mechanical Volume of an Augmented Reality Head-Up Display System | 28 Dec 2018 | ||
White paper | DLP® Technology: Solar Loading in Augmented Reality Head-up Display Systems | 22 Jul 2018 |
Design & development
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Supported products & hardware
Products
Near-UV products (400 to 420 nm)
≥ 0.47-in array products
≤ 0.47-in array pico products
UV products (< 400 nm)
Visible products (420 to 700 nm)
Spectroscopy & optical networking products
Exterior lighting & projection products
Display products
Near-infrared products (> 700 nm)
Multi-channel ICs (PMICs)
Hardware development
Evaluation board
Development kit
Optical module
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
PBGA (ZDQ) | 324 | Ultra Librarian |
Ordering & quality
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- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
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