This reference design integrates TI's Power over Ethernet (PoE) with the high-performance SimpleLink™ MSP432E4 Ethernet microcontroller (MCU) with Ethernet to enable customers to develop applications for Internet of Things (IoT) in a small form factor board. The design increases the value of the end application with its ability to derive power over existing network cabling combined with intelligence to gather, process, and exchange data with the cloud.
A fully assembled board has been developed for testing and performance validation only, and is not available for sale.
Download ready-to-use system files to speed your design process.
Reference design overview and verified performance test data
Detailed schematic diagram for design layout and components
Complete listing of design components, reference designators, and manufacturers/part numbers
Detailed overview of design layout for component placement
Files used for 3D models or 2D drawings of IC components
Design file that contains information on physical board layer of design PCB
PCB layer plot file used for generating PCB design layout
Includes TI products in the design and potential alternatives.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Design guide | Power over Ethernet (PoE) reference design for industrial gateways (TIDM-1018) (Rev. A) | Jan. 14, 2019 | |
| White paper | Reducing the cost, power and size of connectivity in industrial gateway designs | Mar. 28, 2018 |
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