The TPS54623 in thermally enhanced VQFN package is a full featured 17-V, 6-A synchronous step-down converter which is optimized for small designs through high efficiency and integrating the high-side and low-side MOSFETs. Further space savings are achieved through current mode control, which reduces component count, and by selecting a high switching frequency, reducing the inductor’s footprint.
The output voltage start-up ramp is controlled by the SS/TR pin, which allows operation as either a stand alone power supply or in tracking situations. Power sequencing is also possible by correctly configuring the enable and the open drain power good pins.
Cycle-by-cycle current limiting on the high-side FET protects the device in overload situations and is enhanced by a low-side sourcing current limit which prevents current runaway. There is also a low-side sinking current limit that turns off the low-side MOSFET to prevent excessive reverse current. Hiccup protection will be triggered if the overcurrent condition has persisted for longer than the preset time. Thermal hiccup protection disables the device when the die temperature exceeds the thermal shutdown temperature and enables the part again after the built-in thermal shutdown hiccup time. The TPS54623 operates at continuous current mode (CCM) at higher load conditions while skipping pulses to boost the efficiency at light loads.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | TPS54623 4.5-V to 17-V Input, 6-A Synchronous Step-Down SWIFT™ Converter With Light Load Efficiency and Hiccup Overcurrent Protection datasheet (Rev. C) | PDF | HTML | 10 Oct 2017 |
| Application note | Semiconductor and IC Package Thermal Metrics (Rev. D) | PDF | HTML | 25 Mar 2024 | |
| EVM User's guide | TPS54623 Step-Down Converter Evaluation Module User's Guide (Rev. A) | PDF | HTML | 23 Aug 2021 | |
| Application note | Calculating Efficiency (Rev. A) | 06 Mar 2020 | ||
| Application note | Minimizing Output Ripple During Startup (Rev. A) | 20 May 2019 | ||
| Selection guide | Power Management Guide 2018 (Rev. R) | 25 Jun 2018 | ||
| Application note | Minimizing Output Ripple During Startup | 22 Jun 2017 | ||
| Application note | Understanding Thermal Dissipation and Design of a Heatsink | 04 May 2011 |
For additional terms or required resources, click any title below to view the detail page where available.
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| VQFN (RHL) | 14 | Ultra Librarian |
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