Home Logic & voltage translation Flip-flops, latches & registers D-type latches
Home
Logic & voltage translation
Flip-flops, latches & registers
D-type latches

SN74AHCT16373

ACTIVE

16-Bit Transparent D-Type Latches With 3-State Outputs

Order now
Data sheet

SN74AHCT16373

ACTIVE
Data sheet Order now

Product details

Number of channels 16 Technology family AHCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 110 IOL (max) (mA) 8 IOH (max) (mA) -8 Supply current (max) (µA) 40 Features Balanced outputs, Flow-through pinout, Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 125 Rating Catalog
Number of channels 16 Technology family AHCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 110 IOL (max) (mA) 8 IOH (max) (mA) -8 Supply current (max) (µA) 40 Features Balanced outputs, Flow-through pinout, Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 125 Rating Catalog
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
  • Members of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Process
  • Inputs are TTL-Voltage Compatible
  • Distributed VCC and GND Pins Minimize High-Speed
    Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883,
    Method 3015; Exceeds 200 V Using Machine Model
    (C = 200 pF, R = 0)
  • Package Options Include:
    • Plastic Shrink Small-Outline (DL) Package
    • Thin Shrink Small-Outline (DGG) Package
    • Thin Very Small-Outline (DGV) Package
    • 80-mil Fine-Pitch Ceramic Flat (WD) Package
      Using 25-mil Center-to-Center Spacings
  • Members of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Process
  • Inputs are TTL-Voltage Compatible
  • Distributed VCC and GND Pins Minimize High-Speed
    Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883,
    Method 3015; Exceeds 200 V Using Machine Model
    (C = 200 pF, R = 0)
  • Package Options Include:
    • Plastic Shrink Small-Outline (DL) Package
    • Thin Shrink Small-Outline (DGG) Package
    • Thin Very Small-Outline (DGV) Package
    • 80-mil Fine-Pitch Ceramic Flat (WD) Package
      Using 25-mil Center-to-Center Spacings

The SNxAHCT16373 devices are 16-bit transparent D-type latches with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The SNxAHCT16373 devices are 16-bit transparent D-type latches with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
filter Find other D-type latches
Download

Similar products you might be interested in

open-in-new Compare alternates
Pin-for-pin with same functionality to the compared device
74ACT16373 ACTIVE 16-Bit D-Type Transparent Latches With 3-State Outputs Higher average drive strength (24mA)
Similar functionality to the compared device
SN74LV373A ACTIVE Octal transparent D-type latches with 3-state outputs Voltage range (2V to 5.5V), average drive strength (12mA), average propagation delay (9ns)

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 1
Type Title Date
* Data sheet SNx4AHCT16373 16-Bit Transparent D-Type Latches With 3-State Outputs datasheet (Rev. I) PDF | HTML 05 Aug 2014

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​