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SIMPLELINK-LOWPOWER-F3-SDK
SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices
Products
Low-power 2.4-GHz products
Automotive wireless connectivity products
Hardware development
Evaluation board
Documentation
Release Information
The SimpleLink™ Low Power F3 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC23xx and CC27xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC23xx and CC27xx wireless MCU users by packaging essential software components, such as:
- Bluetooth® Low Energy (BLE) protocol stack
- Zigbee® protocol stack supporting low power wireless mesh networks
- ProprietaryRF 2.4 GHz stack
- TI Drivers
All of the above are provided in one easy-to-use software package along with example applications and documentation.
The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit TI SimpleLink Wireless Connectivity.
What's new
- CC27xx family of devices are now supported.
- The CC2745R10-Q1 is suitable to evaluate other device variants in the CC27xx family of devices. For more information regarding the new device, please visit the product page https://www.ti.com/product/CC2745R10-Q1.
- Bluetooth LE 5.4 qualified stack for the CC27xx devices.
- Controller-Only examples have been added for the CC23xx and CC27xx family of devices.
- Early access to Zigbee Stack; Fully qualified on CC2340Rx only.