TIPD135
10 µA to 100 mA, 0.05% error, high-side current sensing reference design
TIPD135
Overview
This precision verified design provides the theory, component selection, simulation, complete PCB schematic and layout, bill of materials, and measured performance of a split-supply, high-side four decade current sensing solution that can accurately detect load currents from 10uA-100mA. The corresponding linear output is from 10mV to 4.9V which enables measurement by common 5V ADCs. The design utilizes the PGA281, an instrumentation amplifier with pin-programmable gain and a wide common-mode voltage range, to provide a more accurate and versatile solution than traditional op amps.
Features
- High-Side, Four Decade, Bi-directional, Current Sensing Verified Solution
- Senses Current from 10uA-100mA with <0.05% Error
- Supports up to ±12.5V Common-mode Input Range
- 10mV to 4.9V output for measurement by common 5V ADCs
- Utilizes PGA281 pin-programmable gain instrumentation amplifier to achieve four decade current measurement
This Verified Design Includes:
- Theory
- Component Selection
- TINA-TI Simulation
- Schematics and PCB Layout
- Verification and Measured Performance
- Modification Options
Industrial
A fully assembled board has been developed for testing and performance validation only, and is not available for sale.
Design files & products
Design files
Download ready-to-use system files to speed your design process.
Detailed schematic diagram for design layout and components
Detailed schematic diagram for design layout and components
Complete listing of design components, reference designators, and manufacturers/part numbers
Design file that contains information on physical board layer of design PCB
Products
Includes TI products in the design and potential alternatives.
Start development
Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | User guide | 10-uA to 100-mA 0.05%-Error High-Side Current Sensing Design Guide | Oct. 03, 2013 |
Support & training
TI E2E™ forums with technical support from TI engineers
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