Typical implementations of linear position measurements use expensive rare-earth magnets. To lower the overall system cost, this reference design describes the implementation of using the industry’s first inductance-to-digital converters (LDC) from TI for linear position sensing without the use of any expensive rare-earth magnets. This reference design also describes the implementation of the ultra-low power two chip solution for inductive linear position sensors by using TI's extended scan interface (ESI) module on the MSP430(TM) microcontrollers (MCUs) and LDC1612 chip. By combining the ESI module on MSP430 MCU and the LDC technology, the reference design provides the designer a low-cost and low-power inductive linear position sensing solution.
Download ready-to-use system files to speed your design process.
Detailed schematic diagram for design layout and components
Complete listing of design components, reference designators, and manufacturers/part numbers
Files used for 3D models or 2D drawings of IC components
Design file that contains information on physical board layer of design PCB
PCB layer plot file used for generating PCB design layout
Includes TI products in the design and potential alternatives.
The MSP-EXP430FR6989 LaunchPad Development Kit is an easy-to-use Evaluation Module (EVM) for the MSP40FR6989 microcontroller (MCU). It contains everything needed to start developing on the ultra-low-power MSP430FRx FRAM microcontroller platform, including on-board emulation for programming, (...)
| Type | Title | Date | ||
|---|---|---|---|---|
| * | User guide | ESI + LDC Inductive Linear Position Sensing Design Guide | Dec. 31, 2015 |
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.