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TIDM-BLE-KEYBOARD
Bluetooth Low Energy keyboard reference design
TIDM-BLE-KEYBOARD
Overview
This solution implements a keyboard for any operation system which supports HOGP (Hid Over GATT Profile). It is designed to have ultra low-power consumption for a substantial time working with Bluetooth Low Energy technology. CC2541 and an ultra-low-power MSP MCU are used in this design to handle BLE stack, key-matrix scan and power management work.
Features
- Low-power, 3mW average when typing at about 300 characters per minute
- Designed with TI Bluetooth Low Energy protocol stack include HOGP implementation
- Full-feature keyboard support up to 128 keys(16 x 8 matrix) without pcb modification
- Turnkey solution for BLE keyboard applications
A fully assembled board has been developed for testing and performance validation only, and is not available for sale.
Design files & products
Design files
Download ready-to-use system files to speed your design process.
TIDU548.PDF (2328 K)
Reference design overview and verified performance test data
TIDRBF9.PDF (131 K)
Detailed schematic diagram for design layout and components
TIDRBG0.PDF (56 K)
Complete listing of design components, reference designators, and manufacturers/part numbers
TIDC719.ZIP (49 K)
Design file that contains information on physical board layer of design PCB
Products
Includes TI products in the design and potential alternatives.
MSP430 microcontrollers
MSP430G2444 — 16 MHz MCU with 8KB Flash, 512B SRAM, 10-bit ADC, UART/SPI/I2C, timer
Data sheet: PDF | HTMLStart development
Technical documentation
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| Type | Title | Date | ||
|---|---|---|---|---|
| Design guide | Bluetooth Low-Energy Keyboard Reference Design Guide | Sep. 19, 2014 |
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