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TIDA-01531
Low-Power Wireless M-Bus Communications Module Reference Design
TIDA-01531
Overview
This reference design explains how to use the TI wireless M-Bus stack for CC1310 and CC1350 wireless MCUs and integrate it into a smart meter or data-collector product. This software stack is compatible with the Open Metering System (OMS) v3.0.1 specification. EN13757-1 through EN13757-7 are European standards for meter reading and include both wired and wireless metering-bus (M-Bus); these together are very popular in ultra-low-power metering and sub-metering applications. This design offers ready-to-use binary images for any of the wireless M-Bus S-, T-, or C-modes at 868 MHz with unidirectional (meter) or bidirectional configurations (both meter and data collector). Multiple precompiled binary images are provided that cover metering applications, including but not limited to heat cost allocators (HCAs), gas, water, and heat meters, or e-meters with an external host MCU.
Features
- Meets EN13757-4 class HR requirements for sensitivity and selectivity and class HT for transmit power in S-, T-, and C-modes
- Complete single-chip implementation with serial interface to host MCU
- Consumes only 0.7 µA @ 3.6 V in shutdown mode
- Embedded (API level) interface for combining wM-Bus stack and meter application
- wM-Bus OMSv3.0.1-compliant S- and T- modes (S1, S2, T1, T2) with C1 and C2 modes added
- Supports meter and data collector (also called "Other") functionality
A fully assembled board has been developed for testing and performance validation only, and is not available for sale.
Design files & products
Design files
Download ready-to-use system files to speed your design process.
TIDUDG0.PDF (7932 K)
Reference design overview and verified performance test data
TIDRST2.PDF (129 K)
Detailed schematic diagram for design layout and components
TIDRST3.PDF (50 K)
Complete listing of design components, reference designators, and manufacturers/part numbers
TIDRST4.PDF (52 K)
Detailed overview of design layout for component placement
TIDRST6.ZIP (3366 K)
Files used for 3D models or 2D drawings of IC components
TIDCDV1.ZIP (300 K)
Design file that contains information on physical board layer of design PCB
TIDRST5.PDF (1083 K)
PCB layer plot file used for generating PCB design layout
Products
Includes TI products in the design and potential alternatives.
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Technical documentation
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| Type | Title | Date | ||
|---|---|---|---|---|
| * | Design guide | Low-Power wM-Bus Communications Module Reference Design | Sep. 22, 2017 | |
| Application brief | Low-power wM-Bus Stack Implementation With CC1310 and CC1350 | PDF | HTML | Oct. 19, 2018 | |
| Application note | Using the MSP430FR6047 Wireless M-Bus Serial Library for Metering Applications | Apr. 05, 2018 |
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