This reference design demonstrates the ability to have a high-density, IO-Link transceiver module, digital output (DO) (1) channel, and a DC-DC buck converter. With the DC-DC this module can power a wide array of external devices, such as microcontrollers (MCUs), sensors, displays, and more. IO-Link and DO communication channels offer a wide range of flexibility for different applications. This reference design will fit applications that require a combination of sensors, such as a flow meters, level sensors, motion sensors, light sensors, or ultrasonic sensors. The TIOL111 and TIOS101 have high tolerances to ESD as outlined in IEC 61000-4-4 and IEC 61000-4-5 (500 Ω), allowing them to be used in industrial settings where there is a potential for high amounts of ESD. With the addition of transient voltage suppression (TVS) diodes, the level of ESD protection can be raised substantially. This reference design only implements the physical layer of IO-Link.
A fully assembled board has been developed for testing and performance validation only, and is not available for sale.
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Reference design overview and verified performance test data
Detailed schematic diagram for design layout and components
Complete listing of design components, reference designators, and manufacturers/part numbers
Detailed overview of design layout for component placement
Files used for 3D models or 2D drawings of IC components
Design file that contains information on physical board layer of design PCB
PCB layer plot file used for generating PCB design layout
Includes TI products in the design and potential alternatives.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Design guide | IO-Link With Digital Output and DC-DC Reference Design | Sep. 29, 2017 |
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