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TIDA-01063
High Accuracy AC Current Measurement Reference Design using PCB Rogowski Coil Sensor
TIDA-01063
Overview
TIDA-01063 is a reference design for current sensing using a PCB Rogowski Coil sensor to achieve very good linearity for wide measurement range at very low system BOM cost. PCB Rogowski sensor is advantageous for isolated current measurement due to very high bandwidth of 20 MHz and fast settling time of 50 ns. Auto-zeroing, 12nV/√Hz noise density of INA188 makes it suitable to achieve 12 bit system resolution for full scale current of 1000 A. Using simple IIR digital integration algorithm and scalable sampling rate it is possible to achieve better magnitude and phase response.
Features
- 0.058% Non-Linearity (Least Square Best Fit Straight Line)
- Very high sensor bandwidth of 20 MHz
- Uncalibrated accuracy of 0.2%
- Theoretical settling time of 50 ns
- No core saturation
A fully assembled board has been developed for testing and performance validation only, and is not available for sale.
Design files & products
Design files
Download ready-to-use system files to speed your design process.
TIDUBV4A.PDF (1704 K)
Reference design overview and verified performance test data
TIDRM37.PDF (373 K)
Detailed schematic diagram for design layout and components
TIDRM36.PDF (81 K)
Complete listing of design components, reference designators, and manufacturers/part numbers
TIDRM34.PDF (173 K)
Detailed overview of design layout for component placement
TIDRM33.ZIP (1328 K)
Files used for 3D models or 2D drawings of IC components
TIDCC92.ZIP (408 K)
Design file that contains information on physical board layer of design PCB
TIDRM35.PDF (822 K)
PCB layer plot file used for generating PCB design layout
TIDRM38.PDF (321 K)
PCB layer plot file used for generating PCB design layout
Products
Includes TI products in the design and potential alternatives.
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Technical documentation
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| Type | Title | Date | ||
|---|---|---|---|---|
| * | Design guide | High Accuracy AC Current Measurement Using PCB Rogowski Coil Sensor Design Guide (Rev. A) | Jul. 05, 2016 |
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