This reference design gives an example implementation of an IO-Link device interface. The design includes the IO-Link device physical layer (PHY) including a low-dropout (LDO) as well as a low-power microcontroller. This combination supports IO-Link COM3 transfer rate and a cycle time of 400μs. The MSPM0 microcontroller integrates an internal oscillator, so the MCU is able to run this application without the need of an external crystal, saving cost and space.
Features
- Crystal-less operation with internal 32-MHz oscillator
- Low-power Arm® Cortex® M0+ microcontroller with IO-Link device stack developed by TEConcept
- Two-chip design with PHY internal 20-mA LDO
- Device transceiver with integrated EMC protection according to IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT), and IEC 61000-4-5 (Surge)
- Limited output driver rise time and fall time to minimize overshoots and EMI