TIDA-010263

IO-Link device implementation for sensors and actuator reference design

TIDA-010263

Design files

Overview

This reference design gives an example implementation of an IO-Link device interface. The design includes the IO-Link device physical layer (PHY) including a low-dropout (LDO) as well as a low-power microcontroller. This combination supports IO-Link COM3 transfer rate and a cycle time of 400μs. The MSPM0 microcontroller integrates an internal oscillator, so the MCU is able to run this application without the need of an external crystal, saving cost and space.

Features
  • Crystal-less operation with internal 32-MHz oscillator
  • Low-power Arm® Cortex® M0+ microcontroller with IO-Link device stack developed by TEConcept
  • Two-chip design with PHY internal 20-mA LDO
  • Device transceiver with integrated EMC protection according to IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT), and IEC 61000-4-5 (Surge)
  • Limited output driver rise time and fall time to minimize overshoots and EMI
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

PDF | HTML
TIDUF41A.PDF (1353 K)

Reference design overview and verified performance test data

Products

Includes TI products in the design and potential alternatives.

Arm Cortex-M0+ MCUs

MSPM0L130632-MHz Arm® Cortex®-M0+ MCU with 64-KB flash, 4-KB SRAM, 12-bit ADC, comparator, OPA

Data sheet: PDF | HTML
IO-Link & digital I/Os

TIOL112IO-Link device transceiver with low residual voltage and integrated surge protection

Data sheet: PDF | HTML

Technical documentation

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* Design guide IO-Link device implementation for sensors and actuator reference design (Rev. A) PDF | HTML Jun. 05, 2024

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