BDE-3P-BW335X

BDE BW335x wireless modules

BDE-3P-BW335X

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Overview

BDE-3P-BW335x modules are 2.4-GHz & 5-GHz Dual-Band Wi-Fi 6 (and Bluetooth® Low Energy Combo) wireless modules based on TI´s CC3351/CC3350. These modules are ideal for cost-sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the application throughput requirement is up to 50Mbps. Different variants are available to meet various integration requirements. The modules offer three antenna options: ANT pin for an external antenna, U.FL connector for an external antenna, and an integrated PCB trace antenna. The operating temperature range is -40℃ to +85℃, with an extended range of -40℃ to +105℃ for the "-IN" (extended industrial) variants. Three form factors are available: regular size LGA package, tiny size LGA package, and M.2 card.

Features

2.4-GHz and 5-GHz Dual-Band Wi-Fi 6 (and Bluetooth® Low Energy Combo)

 

Three antenna options:

  • External antenna
  • U.FL connector
  • Integrated PCB

Operating temperature:

  • -40-85°C
  • -40-105°C (""-IN"")

Three form factors:

  • LGA
  • LGA (tiny size)
  • M.2 card
Wi-Fi products
CC3350 SimpleLink™ dual-band (2.4 and 5 GHz) Wi-Fi 6 companion IC CC3351 SimpleLink™ dual-band (2.4 and 5 GHz) Wi-Fi 6 and Bluetooth® Low Energy companion IC
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Photos courtesy of BDE Technology Inc.

Order & start development

Daughter card

BDE-BW3351xPx

CC3351 Wi-Fi and BLE combo module

Daughter card

BDE-BW3350XPX — CC3350 Wi-Fi module

Daughter card

BDE-BW3350X1 — CC3350 Wi-Fi module (tiny size)

Daughter card

BDE-BW3350NPXM2 — CC3350 Wi-Fi module M.2 card

Daughter card

BDE-BW3351X1 — CC3351 Wi-Fi and BLE combo module (tiny size)

Daughter card

BDE-BW3351NPxM2 — CC3351 Wi-Fi and BLE combo module M.2 card

TI's Standard Terms and Conditions for Evaluation Items apply.

Support & training

Third-party support
TI does not offer ongoing direct design support for this hardware. For support while working through your design, contact BDE Technology Inc..

Videos

Disclaimer

Certain information and resources (including links to non-TI sites) above may be provided by a third-party partner, and is included here merely for your convenience. TI is not the provider of, and is not responsible for, the content of such information and resources, and you should evaluate them carefully for your intended uses and on your own behalf. The inclusion of such information and resources here does not imply endorsement of any third-party company by TI, and shall not be construed as a warranty or representation regarding the suitability of any third-party products or services, either alone or in combination with any TI product or service.