LMV112
- (Typical Values are: VSUPPLY = 2.7V and
CL = 20 pF, Unless Otherwise Specified.) - Small Signal Bandwidth 40 MHz
- Supply Voltage Range 2.4V to 5V
- Slew Rate 110 V/μs
- Total Supply Current 1.6 mA
- Shutdown Current 59 µA
- Rail-to-Rail Input and Output
- Individual Buffer Enable Pins
- Rapid Ton Technology
- Crosstalk Rejection Circuitry
- 8-pin WSON, Pin Access Packaging
- Temperature Range −40°C to 85°C
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The LMV112 is a high speed dual clock buffer designed for portable communications and accurate multi-clock systems. The LMV112 integrates two 40 MHz low noise buffers which optimizes application and out performs large discrete solutions. This device enables superb system operation between the base band and the oscillator signal path while eliminating crosstalk.
Texas Instruments' unique technology and design deliver accuracy, capacitance and load resistance while increasing the drive capability of the device. The low power consumption makes the LMV112 perfect for battery applications.
The robust, independent, and flexible buffers are designed to provide the customer with the ability to manage complex clock signals in the latest wireless applications. The buffers deliver 110 V/μs internal slew rate with independent shutdown and duty cycle precision. The patented analog circuit drives capacitive loads beyond 20 pF. Texas Instruments' proven biasing technique has 1V centering, rail-to-rail input/output unity gain, and AC coupled convenient inputs. These integrated cells save space and require no external bias resistors. Texas Instruments' rapid recovery after disable optimizes performance and current consumption. The LMV112 offers individual enable pin controls and since there is no internal ground reference either single or split supply configurations offer additional system flexibility and power choices.
The LMV112 is a proven replacement for any discrete circuitry and simplifies board layout while minimizing related parasitic components.
The LMV112 is produced in the small WSON package which offers high quality while minimizing its use of PCB space. Texas Instruments' advanced packaging offers direct PCB-IC evaluation via pin access.
技術資料
| 種類 | タイトル | 最新の英語版をダウンロード | 日付 | |||
|---|---|---|---|---|---|---|
| * | データシート | LMV112 40 MHz Dual Clock Buffer データシート (Rev. B) | 2013年 5月 2日 | |||
| EVM ユーザー ガイド (英語) | AN-1799 LMV112 40 MHz Dual Clock Buffer Evaluation Board (Rev. A) | 2013年 4月 30日 | ||||
| アプリケーション・ノート | Use of the LMV112 to Reduce Ref Clk Interaction in Handheld Device (Rev. A) | 2013年 4月 30日 |
設計および開発
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PSPICE-FOR-TI — TI Design / シミュレーション・ツール向け PSpice®
設計とシミュレーション向けの環境である PSpice for TI (...)
TIDA-010057 — Ultrasound smart probe power supply reference design
| パッケージ | ピン数 | CAD シンボル、フットプリント、および 3D モデル |
|---|---|---|
| WSON (NGQ) | 8 | Ultra Librarian |
購入と品質
- RoHS
- REACH
- デバイスのマーキング
- リード端子の仕上げ / ボールの原材料
- MSL 定格 / ピーク リフロー
- MTBF/FIT 推定値
- 使用原材料
- 認定試験結果
- 継続的な信頼性モニタ試験結果
- ファブの拠点
- 組み立てを実施した拠点
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