Home Interface Diodes TVS diodes
Home
Interface
Diodes
TVS diodes
NEW

TSD15C

ACTIVE

15V 13A bidirectional surge-protection diode

Order now
Data sheet

TSD15C

ACTIVE
Data sheet Order now

Product details

Package name SOD323 (SOT) Peak pulse power (8/20 μs) (max) (W) 400 IEC 61000-4-5 (A) 12 Vrwm (V) 14 Breakdown voltage (min) (V) 19 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 6.9 Clamping voltage (V) 25
Package name SOD323 (SOT) Peak pulse power (8/20 μs) (max) (W) 400 IEC 61000-4-5 (A) 12 Vrwm (V) 14 Breakdown voltage (min) (V) 19 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 6.9 Clamping voltage (V) 25
SOT (DYF) 2 3.445 mm² 2.65 x 1.3
  • IEC 61000-4-2 ESD protection:
    • ±30kV contact discharge
    • ±30kV air gap discharge
  • IEC 61000-4-5 surge protection:
    • 6.5-30A (8/20µs)
  • Low IO capacitance < 7pF (typical)
  • Ultra low leakage current: 10nA (maximum)
  • Industrial temperature range: –55°C to +150°C
  • Industry standard SOD-323 leaded package (2.65mm × 1.3mm)
  • IEC 61000-4-2 ESD protection:
    • ±30kV contact discharge
    • ±30kV air gap discharge
  • IEC 61000-4-5 surge protection:
    • 6.5-30A (8/20µs)
  • Low IO capacitance < 7pF (typical)
  • Ultra low leakage current: 10nA (maximum)
  • Industrial temperature range: –55°C to +150°C
  • Industry standard SOD-323 leaded package (2.65mm × 1.3mm)

The TSDxxC are a family of bidirectional TVS protection diodes designed for clamping harmful transients such as ESD and surge. The TSDxxC devices are rated to dissipate ESD strikes up to ±30kV (contact and air gap discharge) which exceeds the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

Combining the robust clamping performance and low capacitance of these devices, TSDxxC are excellent TVS diodes to protect both data lines and power lines in many different applications.

The TSDxxC family is offered in the industry standard, leaded SOD-323 package to enable easy solderability.

The TSDxxC are a family of bidirectional TVS protection diodes designed for clamping harmful transients such as ESD and surge. The TSDxxC devices are rated to dissipate ESD strikes up to ±30kV (contact and air gap discharge) which exceeds the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

Combining the robust clamping performance and low capacitance of these devices, TSDxxC are excellent TVS diodes to protect both data lines and power lines in many different applications.

The TSDxxC family is offered in the industry standard, leaded SOD-323 package to enable easy solderability.
filter Find other TVS diodes
Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 1
Type Title Date
* Data sheet TSDxxC Bidirectional TVS Diodes in SOD-323 Package datasheet (Rev. C) PDF | HTML 24 Oct 2024

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

ESDEVM — ESD evaluation module

The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested. For typical (...)
User guide: PDF | HTML
Not available on TI.com
Simulation model

TSD15C PSpice Transient Model

SLVME87.ZIP (171 KB) - PSpice Model
Download
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Request
Simulation tool

TINA-TI — SPICE-based analog simulation program

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
User guide: PDF
View Options
Package Pins CAD symbols, footprints & 3D models
SOT (DYF) 2 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos