The TSDxxC are a family of bidirectional TVS protection diodes designed for clamping harmful transients such as ESD and surge. The TSDxxC devices are rated to dissipate ESD strikes up to ±30kV (contact and air gap discharge) which exceeds the maximum level specified in the IEC 61000-4-2 international standard (Level 4).
Combining the robust clamping performance and low capacitance of these devices, TSDxxC are excellent TVS diodes to protect both data lines and power lines in many different applications.
The TSDxxC family is offered in the industry standard, leaded SOD-323 package to enable easy solderability.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | TSDxxC Bidirectional TVS Diodes in SOD-323 Package datasheet (Rev. C) | PDF | HTML | 24 Oct 2024 |
| Application note | ESD and Surge Protection for USB Interfaces (Rev. B) | PDF | HTML | 11 Jan 2024 | |
| Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 18 Aug 2022 | |
| Application note | ISO 10605 Road Vehicles Test Methods for Elec. Disturbances from Electrostatic D (Rev. B) | PDF | HTML | 17 Aug 2022 | |
| Application brief | Protecting I/O modules from surge events | 04 Feb 2019 | ||
| White paper | Demystifying surge protection | 06 Nov 2018 | ||
| Application note | How to select a Surge Diode | 29 Aug 2018 |
For additional terms or required resources, click any title below to view the detail page where available.
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| SOT (DYF) | 2 | Ultra Librarian |
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.