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TS5A22364

ACTIVE

0.65-Ω, 5-V, 2:1 (SPDT), 2-channel analog switch with negative signaling capability

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Data sheet

TS5A22364

ACTIVE
Data sheet Order now

Product details

Protocols Analog Audio Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 18.3 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 520 Input/output voltage (min) (V) -3.2 Input/output voltage (max) (V) 5.5 Supply current (typ) (µA) 0.2 ESD HBM (typ) (kV) 1.5 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -78 ESD CDM (kV) 1.5 Input/output continuous current (max) (mA) 350 CON (typ) (pF) 370 Off isolation (typ) (dB) -70 Ron (max) (mΩ) 1300 Ron channel match (max) (Ω) 0.3 RON flatness (typ) (Ω) 0.076 Turnoff time (disable) (max) (ns) 70 Turnon time (enable) (max) (ns) 120 VIH (min) (V) 1.4 VIL (max) (V) 0.8
Protocols Analog Audio Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 18.3 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 520 Input/output voltage (min) (V) -3.2 Input/output voltage (max) (V) 5.5 Supply current (typ) (µA) 0.2 ESD HBM (typ) (kV) 1.5 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -78 ESD CDM (kV) 1.5 Input/output continuous current (max) (mA) 350 CON (typ) (pF) 370 Off isolation (typ) (dB) -70 Ron (max) (mΩ) 1300 Ron channel match (max) (Ω) 0.3 RON flatness (typ) (Ω) 0.076 Turnoff time (disable) (max) (ns) 70 Turnon time (enable) (max) (ns) 120 VIH (min) (V) 1.4 VIL (max) (V) 0.8
DSBGA (YZP) 10 2.8125 mm² 2.25 x 1.25 VSON (DRC) 10 9 mm² 3 x 3 VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • Specified Break-Before-Make Switching
  • Negative Signaling Capability: Maximum Swing from –2.75 V to 2.75 V (VCC = 2.75 V)
  • Internal Shunt Switch Prevents Audible Click-and-Pop When Switching Between Two Sources
  • Low ON-State Resistance (0.65 Ω Typical)
  • Low Charge Injection
  • Excellent ON-State Resistance Matching
  • 2.3-V to 5.5-V Power Supply (VCC)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2500-V Human-Body Model
      (A114-B, Class II)
    • 1500-V Charged-Device Model (C101)
    • 200-V Machine Model (A115-A)
  • Specified Break-Before-Make Switching
  • Negative Signaling Capability: Maximum Swing from –2.75 V to 2.75 V (VCC = 2.75 V)
  • Internal Shunt Switch Prevents Audible Click-and-Pop When Switching Between Two Sources
  • Low ON-State Resistance (0.65 Ω Typical)
  • Low Charge Injection
  • Excellent ON-State Resistance Matching
  • 2.3-V to 5.5-V Power Supply (VCC)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2500-V Human-Body Model
      (A114-B, Class II)
    • 1500-V Charged-Device Model (C101)
    • 200-V Machine Model (A115-A)

The TS5A22364 is a bidirectional, 2-channel, single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V. The device features negative signal capability that allows signals below ground to pass through the switch without distortion. Additionally, the TS5A22364 includes an internal shunt switch, which automatically discharges any capacitance at the NC or NO terminals when they are unconnected to COM. This reduces the audible click/pop noise when switching between two sources. The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications. The 3.00-mm x 3.00-mm DRC package is also available as a nonmagnetic package for medical imaging applications.

The TS5A22364 is a bidirectional, 2-channel, single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V. The device features negative signal capability that allows signals below ground to pass through the switch without distortion. Additionally, the TS5A22364 includes an internal shunt switch, which automatically discharges any capacitance at the NC or NO terminals when they are unconnected to COM. This reduces the audible click/pop noise when switching between two sources. The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications. The 3.00-mm x 3.00-mm DRC package is also available as a nonmagnetic package for medical imaging applications.
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Technical documentation

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Type Title Date
* Data sheet TS5A22364 0.65-Ω Dual SPDT Analog Switches With Negative Signaling Capability datasheet (Rev. H) PDF | HTML 21 Jun 2017
Application brief 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) PDF | HTML 26 Jul 2022
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dec 2021
Application note Preventing Excess Power Consumption on Analog Switches 03 Jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design & development

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Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
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Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
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Simulation model

TS5A22364 HSpice Model

SCDM123.ZIP (105 KB) - HSpice Model
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Simulation model

TS5A22364 IBIS Model

SCDM122.ZIP (67 KB) - IBIS Model
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Package Pins CAD symbols, footprints & 3D models
DSBGA (YZP) 10 Ultra Librarian
VSON (DRC) 10 Ultra Librarian
VSSOP (DGS) 10 Ultra Librarian
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