The TMUX7236 is a complementary metal-oxide semiconductor (CMOS) switch with latch-up immunity in a dual channel, 2:1 configuration. The device works well with dual supplies (±5 V to ±22 V), a single supply (5 V to 44 V), or asymmetric supplies (such as V DD = 12 V, V SS = –5 V). The TMUX7236 supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from V SS to V DD.
All logic control inputs support logic levels from 1.8 V to V DD, allowing for both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | TMUX7236 44 V, Low-RON, 2:1 (SPDT), 2-Channel Precision Switch With Latch-Up Immunity and 1.8 V Logic datasheet (Rev. B) | PDF | HTML | 01 Dec 2023 |
| Application note | How to Handle High Voltage Common Mode Applications using Multiplexers | PDF | HTML | 03 Oct 2022 |
For additional terms or required resources, click any title below to view the detail page where available.
The TMUX-24PW-EVM evaluation module allows for the quick prototyping and DC characterization of the TI line of TMUX products that use 16-, 20- or 24-pin TSSOP packages (PW) and is rated for high-voltage operation.
The TMUXRUM-RRPEVM allows for the quick prototyping and DC characterization of the TI line of TMUX products that use 16-pin RUM or RRP packages (QFN) and is rated for high-voltage operation.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
| WQFN (RUM) | 16 | Ultra Librarian |
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.