The TMUX1121, TMUX1122, and TMUX1123 are precision complementary metal-oxide semiconductor (CMOS) devices that have two independently selectable 1:1, single-pole, single-throw (SPST) switches. Wide operating supply of 1.08V to 5.5V allows for use in a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from GND to VDD.
The switches of the TMUX1121 are turned on with Logic 1 on the appropriate logic control inputs, while Logic 0 is required to turn on switches in the TMUX1122. The two channels of the TMUX1123 are split with channel one supporting Logic 1, while channel two supports Logic 0. The TMUX1123 exhibits break-before-make switching, allowing the device to be used in cross-point switching applications.
The TMUX112x devices are part of the precision switches and multiplexers family. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of 7nA and small package options enable use in portable applications.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | TMUX112x 5-V, Low-Leakage-Current, 1:1 (SPST), 2-Channel Precision Switches datasheet (Rev. B) | PDF | HTML | 06 Feb 2024 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 02 Jun 2022 | |
| Application note | Guarding in Multiplexer Applications | PDF | HTML | 13 May 2022 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 01 Dec 2021 |
For additional terms or required resources, click any title below to view the detail page where available.
Speed up your op amp prototyping and testing with the DIP adapter evaluation module (DIP-ADAPTER-EVM), which provides a fast, easy and inexpensive way to interface with small surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them (...)
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| VSSOP (DGK) | 8 | Ultra Librarian |
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.