Product details

Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Number of channels 8 IOL (max) (mA) 24 Supply current (max) (µA) 40 IOH (max) (mA) -24 Input type Standard CMOS Output type 3-State Features Balanced outputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Number of channels 8 IOL (max) (mA) 24 Supply current (max) (µA) 40 IOH (max) (mA) -24 Input type Standard CMOS Output type 3-State Features Balanced outputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
PDIP (N) 20 228.702 mm² 24.33 x 9.4 SOIC (DW) 20 131.84 mm² 12.8 x 10.3 SOP (NS) 20 98.28 mm² 12.6 x 7.8 SSOP (DB) 20 56.16 mm² 7.2 x 7.8 TSSOP (PW) 20 41.6 mm² 6.5 x 6.4 TVSOP (DGV) 20 32 mm² 5 x 6.4 VQFN (RGY) 20 15.75 mm² 4.5 x 3.5 X1QFN (RWP) 20 8.25 mm² 3.3 x 2.5
  • Operates From 1.65 V to 3.6 V
  • Inputs Accept Voltages to 5.5 V
  • Specified From –40°C to +85°C and –40°C to +125°C
  • Maximum tpd of 5.9 ns at 3.3 V
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C
  • Supports Mixed-Mode Signal Operation on All Ports (5-V Input or Output Voltage With 3.3-V VCC)
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Can Be Used as a Down Translator to Translate Inputs From a Maximum of 5.5 V Down to the VCC Level
  • Available in Ultra Small Logic QFN Package (0.5 mm Maximum Height)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model
  • Operates From 1.65 V to 3.6 V
  • Inputs Accept Voltages to 5.5 V
  • Specified From –40°C to +85°C and –40°C to +125°C
  • Maximum tpd of 5.9 ns at 3.3 V
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C
  • Supports Mixed-Mode Signal Operation on All Ports (5-V Input or Output Voltage With 3.3-V VCC)
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Can Be Used as a Down Translator to Translate Inputs From a Maximum of 5.5 V Down to the VCC Level
  • Available in Ultra Small Logic QFN Package (0.5 mm Maximum Height)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model

These octal bus buffers are designed for 1.65-V to 3.6-V VCC operation. The SN74LVC244A devices are designed for asynchronous communication between data buses.

These octal bus buffers are designed for 1.65-V to 3.6-V VCC operation. The SN74LVC244A devices are designed for asynchronous communication between data buses.

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Drop-in replacement with upgraded functionality to the compared device
SN74AUC244 ACTIVE 8-ch, 0.8-V to 2.7-V high speed buffers with 3-state outputs Smaller voltage range (0.8V to 2.7V), shorter average propagation delay (1.7ns)

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 29
Type Title Date
* Data sheet SN74LVC244A Octal Buffer or Driver With 3-State Outputs datasheet (Rev. AC) 24 Sep 2020
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Application note Optimizing AC Drive Control Panel Systems With Logic and Translation Use Cases 20 Jan 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Technical article The next-generation QFN: Do you have what it takes to use it? PDF | HTML 14 Sep 2016
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note LVC Characterization Information 01 Dec 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

14-24-LOGIC-EVM — Logic product generic evaluation module for 14-pin to 24-pin D, DB, DGV, DW, DYY, NS and PW packages

The 14-24-LOGIC-EVM evaluation module (EVM) is designed to support any logic device that is in a 14-pin to 24-pin D, DW, DB, NS, PW, DYY or DGV package,

User guide: PDF | HTML
Not available on TI.com
Evaluation board

14-24-NL-LOGIC-EVM — Logic product generic evaluation module for 14-pin to 24-pin non-leaded packages

14-24-NL-LOGIC-EVM is a flexible evaluation module (EVM) designed to support any logic or translation device that has a 14-pin to 24-pin BQA, BQB, RGY, RSV, RJW or RHL package.

User guide: PDF | HTML
Not available on TI.com
Simulation model

HSPICE Model for SN74LVC244A

SCAJ008.ZIP (114 KB) - HSpice Model
Simulation model

SN74LVC244A Behavioral SPICE Model

SCAM102.ZIP (7 KB) - PSpice Model
Simulation model

SN74LVC244A IBIS Model (Rev. C)

SCAM008C.ZIP (42 KB) - IBIS Model
Reference designs

TIDA-01233 — Ultra-Small, Flexible LED Expansion Reference Design

This document focuses on two reference designs using the SN74HC595B 8-bit Shift Register with 3-State Output Registers and the SN74LVC244A Octal Buffer with 3-State Outputs, each used to expand three general purpose outputs on a microcontroller to eight or more general purpose outputs. Both (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDEP0081 — Wideband Receiver Design Using 66AK2L06 JESD204B Attach to ADC32RF80 Reference Design

For wideband receiver system developers currently using FPGA or ASIC to connect High Speed data converters to a baseband processor, who need faster time to market with increased performance and significant reduction in cost, power, and size. This reference design includes the first widely available (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDEP0056 — Thermal Printing with the PRU-ICSS on the BeagleBone Black Reference Design

The Programmable Realtime Unit – Industrial Communications Sub-System (PRU-ICSS) is a versatile component of the AM335x SoC that enables real-time, deterministic, fast GPIO control, even when running a non-deterministic operating system. This reference design provides a concrete use case and (...)
Design guide: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
PDIP (N) 20 Ultra Librarian
SOIC (DW) 20 Ultra Librarian
SOP (NS) 20 Ultra Librarian
SSOP (DB) 20 Ultra Librarian
TSSOP (PW) 20 Ultra Librarian
TVSOP (DGV) 20 Ultra Librarian
VQFN (RGY) 20 Ultra Librarian
X1QFN (RWP) 20 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos