Home Switches & multiplexers Analog switches & muxes
Home
Switches & multiplexers
Analog switches & muxes

SN74LVC1G66

ACTIVE

5-V, 1:1 (SPST), 1-channel analog switch

Order now
Data sheet

SN74LVC1G66

ACTIVE
Data sheet Order now

Product details

Configuration 1:1 SPST Number of channels 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 7.5 CON (typ) (pF) 13 ON-state leakage current (max) (µA) 1 Supply current (typ) (µA) 1 Bandwidth (MHz) 300 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 50 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 1:1 SPST Number of channels 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 7.5 CON (typ) (pF) 13 ON-state leakage current (max) (µA) 1 Supply current (typ) (µA) 1 Bandwidth (MHz) 300 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 50 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
DSBGA (YZP) 5 2.1875 mm² 1.75 x 1.25 SOT-23 (DBV) 5 8.12 mm² 2.9 x 2.8 SOT-5X3 (DRL) 5 2.56 mm² 1.6 x 1.6 SOT-SC70 (DCK) 5 4.2 mm² 2 x 2.1 USON (DRY) 6 1.45 mm² 1.45 x 1 X2SON (DSF) 6 1 mm² 1 x 1
  • Available in the Texas Instruments NanoFree™ Package
  • 1.65-V to 5.5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 0.8 ns at 3.3 V
  • High On-Off Output Voltage Ratio
  • High Degree of Linearity
  • High Speed, Typically 0.5 ns (VCC = 3 V,
    CL = 50 pF)
  • Low ON-State Resistance, Typically ≉5.5 Ω (VCC = 4.5 V)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoFree™ Package
  • 1.65-V to 5.5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 0.8 ns at 3.3 V
  • High On-Off Output Voltage Ratio
  • High Degree of Linearity
  • High Speed, Typically 0.5 ns (VCC = 3 V,
    CL = 50 pF)
  • Low ON-State Resistance, Typically ≉5.5 Ω (VCC = 4.5 V)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

This single analog switch is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G66 device can handle analog and digital signals. The device permits bidirectional transmission of signals with amplitudes of up to 5.5 V (peak).

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This single analog switch is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G66 device can handle analog and digital signals. The device permits bidirectional transmission of signals with amplitudes of up to 5.5 V (peak).

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
filter Find other Analog switches & muxes
Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 29
Type Title Date
* Data sheet SN74LVC1G66 Single Bilateral Analog Switch datasheet (Rev. Q) PDF | HTML 23 Mar 2017
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dec 2021
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note LVC Characterization Information 01 Dec 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

DIP-ADAPTER-EVM — DIP adapter evaluation module

Speed up your op amp prototyping and testing with the DIP adapter evaluation module (DIP-ADAPTER-EVM), which provides a fast, easy and inexpensive way to interface with small surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them (...)

User guide: PDF
Not available on TI.com
Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
Not available on TI.com
Simulation model

HSPICE MODEL OF SN74LVC1G66

SCEJ198.ZIP (87 KB) - HSpice Model
Download
Simulation model

SN74LVC1G66 IBIS Model (Rev. B)

SCEM332B.ZIP (34 KB) - IBIS Model
Download
Reference designs

TIDA-010941 — Smart analog sensor interface for smoke detection with ambient light cancellation reference design

This reference design provides a low BOM cost smoke detector design that passes UL217 9th edition sensitivity and fire room tests. Using a modulation-based photoelectric architecture, this reference design is able to achieve high rejection of ambient light for application in chambered or (...)
Design guide: PDF
Package Pins CAD symbols, footprints & 3D models
DSBGA (YZP) 5 Ultra Librarian
SOT-23 (DBV) 5 Ultra Librarian
SOT-5X3 (DRL) 5 Ultra Librarian
SOT-SC70 (DCK) 5 Ultra Librarian
USON (DRY) 6 Ultra Librarian
X2SON (DSF) 6 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos