Product details

Technology family LVC Number of channels 1 Operating temperature range (°C) -40 to 85 Rating Catalog Supply current (max) (µA) 10
Technology family LVC Number of channels 1 Operating temperature range (°C) -40 to 85 Rating Catalog Supply current (max) (µA) 10
DSBGA (YZP) 6 2.1875 mm² 1.75 x 1.25 SOT-23 (DBV) 6 8.12 mm² 2.9 x 2.8 SOT-5X3 (DRL) 6 2.56 mm² 1.6 x 1.6 SOT-SC70 (DCK) 6 4.2 mm² 2 x 2.1 USON (DRY) 6 1.45 mm² 1.45 x 1
  • Available in the Texas Instruments
    NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Supports Down Translation to VCC
  • Maximum tpd of 4 ns at 3.3 V
  • Low Power Consumption, 10-µA Maximum ICC
  • ±24-mA Output Drive at 3.3 V
  • VOLP (Output Ground Bounce)
    <0.8 V Typical at VCC = 3.3 V, TA = 25°C
  • VOHV (Output VOH Undershoot)
    >2 V Typical at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down
    Mode, and Back-Drive Protection
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments
    NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Supports Down Translation to VCC
  • Maximum tpd of 4 ns at 3.3 V
  • Low Power Consumption, 10-µA Maximum ICC
  • ±24-mA Output Drive at 3.3 V
  • VOLP (Output Ground Bounce)
    <0.8 V Typical at VCC = 3.3 V, TA = 25°C
  • VOHV (Output VOH Undershoot)
    >2 V Typical at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down
    Mode, and Back-Drive Protection
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

This decoder/demultiplexer is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G19 device is a 1-of-2 decoder / demultiplexer. When E input is high, the decoder will be disabled and both outputs will be high. When E input is low, the A input selects which output will be low.

This device is fully specified for partial-power-down applications using Ioff.

This decoder/demultiplexer is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G19 device is a 1-of-2 decoder / demultiplexer. When E input is high, the decoder will be disabled and both outputs will be high. When E input is low, the A input selects which output will be low.

This device is fully specified for partial-power-down applications using Ioff.

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Technical documentation

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Type Title Date
* Data sheet SN74LVC1G19 1-of-2 Decoder and Demultiplexer datasheet (Rev. G) PDF | HTML 31 Aug 2015
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note LVC Characterization Information 01 Dec 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

5-8-LOGIC-EVM — Generic logic evaluation module for 5-pin to 8-pin DCK, DCT, DCU, DRL and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
User guide: PDF
Not available on TI.com
Simulation model

SN74LVC1G19 IBIS Model (Rev. A)

SCEM356A.ZIP (43 KB) - IBIS Model
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Design guide: PDF
Schematic: PDF
Reference designs

TIDA-01552 — 8 Channel, 2-A High-Side Driver Reference Design for Digital Output Modules

This eight-channel, parallel, 2-A, high-side, digital output reference design for factory automation applications like PLCs shows the diagnostic features and the power density of new Texas Instruments high-side driver components (such as TPS27S100). Each output can individually measure the output (...)
Design guide: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
DSBGA (YZP) 6 Ultra Librarian
SOT-23 (DBV) 6 Ultra Librarian
SOT-5X3 (DRL) 6 Ultra Librarian
SOT-SC70 (DCK) 6 Ultra Librarian
USON (DRY) 6 Ultra Librarian

Ordering & quality

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  • MSL rating/Peak reflow
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  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

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