The ISOTMP35 is the industry’s first isolated temperature sensor IC, combining an integrated isolation barrier, up to 3000VRMS withstand voltage, with an analog temperature sensor featuring a 10mV/°C slope from –40°C to 150°C. This integration enables the sensor to be co-located with high voltage heat sources (for example: HV FETs, IGBTs, or HV contactors) without requiring expensive isolation circuitry. The direct contact with the high-voltage heat source also provides greater accuracy and faster thermal response compared with approaches where the sensor is placed further away to meet isolation requirements.
Operating from a non-isolated 2.3V to 5.5V supply, the ISOTMP35 allows easy integration into applications where sub-regulated power is not available on the high-voltage plane.
The integrated isolation barrier satisfies UL 1577 requirements. The surface mount package (7-pin SOIC) provides excellent heat flow from the heat source to the embedded thermal sensor, minimizing thermal mass and providing more accurate heat-source measurement. This reduces the need for time-consuming thermal modeling and improves system design margin by reducing mechanical variations due to manufacturing and assembly.
The ISOTMP35 class-AB output driver provides a strong 500µA maximum output to drive capacitive loads up to 1000pF and is designed to directly interface with analog-to-digital converter (ADC) sample and hold inputs.
The ISOTMP35 is the industry’s first isolated temperature sensor IC, combining an integrated isolation barrier, up to 3000VRMS withstand voltage, with an analog temperature sensor featuring a 10mV/°C slope from –40°C to 150°C. This integration enables the sensor to be co-located with high voltage heat sources (for example: HV FETs, IGBTs, or HV contactors) without requiring expensive isolation circuitry. The direct contact with the high-voltage heat source also provides greater accuracy and faster thermal response compared with approaches where the sensor is placed further away to meet isolation requirements.
Operating from a non-isolated 2.3V to 5.5V supply, the ISOTMP35 allows easy integration into applications where sub-regulated power is not available on the high-voltage plane.
The integrated isolation barrier satisfies UL 1577 requirements. The surface mount package (7-pin SOIC) provides excellent heat flow from the heat source to the embedded thermal sensor, minimizing thermal mass and providing more accurate heat-source measurement. This reduces the need for time-consuming thermal modeling and improves system design margin by reducing mechanical variations due to manufacturing and assembly.
The ISOTMP35 class-AB output driver provides a strong 500µA maximum output to drive capacitive loads up to 1000pF and is designed to directly interface with analog-to-digital converter (ADC) sample and hold inputs.