The ISO652x devices are high-performance, dual-channel functional isolators designed for cost sensitive, space constrained applications that require isolation for non-safety applications. The isolation barrier supports a working voltage of 200VRMS / 280VDC and transient over voltages of 570VRMS / 800VDC.
The devices provide high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by TI’s double capacitive silicon dioxide (SiO2) insulation barrier. ISO6520 has two isolation channels with both channels in the same direction. ISO6521 has two isolation channels with one channel in each direction. In the event of input power or signal loss, the default output is high for devices without suffix F and low for devices with suffix F. See Device Functional Modes section for further details.
These devices help prevent noise currents on data buses, such as UART, SPI, RS-485, RS-232, and CAN from damaging sensitive circuitry. Through chip design and layout techniques, the electromagnetic compatibility of the devices have been significantly enhanced to ease system-level ESD and emissions compliance.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | ISO652x General Purpose Dual-Channel Functional Isolators datasheet (Rev. B) | PDF | HTML | 10 Apr 2024 |
| White paper | Shrinking Solution Size and Cost With Functional Isolation | PDF | HTML | 22 Aug 2024 | |
| Product overview | Isolating UART Signals (Rev. A) | PDF | HTML | 18 Jun 2024 | |
| Application brief | Understanding Functional Isolation (Rev. A) | PDF | HTML | 02 Jan 2024 | |
| EVM User's guide | ISO652x Dual-Channel Functional Isolators Evaluation Module | PDF | HTML | 25 Jul 2023 |
For additional terms or required resources, click any title below to view the detail page where available.
ISO6521REUEVM is an evaluation module (EVM) used to evaluate the dual-channel ISO6521 functional isolator in the 8-pin DFN package. The EVM has additional footprints that gives the user flexibility to add componenents to test a variety of common applications. The EVM also features multiple test (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| SOIC (D) | 8 | Ultra Librarian |
| VSON (REU) | 8 | Ultra Librarian |
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