Packaged in wafer scale
package (WSP) for small PCB footprint
Provides efficient direct
connection to battery by employing several integrated switched mode
power supplies (DC2DC)
Seamless integration with
TI Sitara and other application processors
Operating temperature:
-40°C to +85°C
105°C Extended
temperature range is supported only in defined use-case profile
Wi-Fi®
Baseband processor and RF Transceiver with
support for IEEE 802.11b/g/n
Integrated 2.4G-Hz PA for complete WLAN
solution
Medium access controller
Hardware-based encryption and decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
Support Wi-Fi Protected Access (WPA, WPA2, WPA3)and IEEE 802.11i
IEEE Std 802.11d,e,h,i,k,r PICS Compliant
802.11v support for high-precision timing and location approximation
Supports 4 bit SDIO host interface, including High Speed (H3) and V3 modes
Bluetooth® and Bluetooth Low Energy (WL1831 only)
Bluetooth 5.1 secure connection compliant and CSA2 support (Declaration ID: D032799)
Host controller interface (HCI) transport for Bluetooth over UART
Dedicated audio processor support for SBC encoding and A2DP
Dual-mode Bluetooth and Bluetooth Low Energy
TI's Bluetooth and Bluetooth Low Energy certified stack
Key Benefits
Differentiated use cases by configuring WiLink 8
simultaneously in two roles (STA and AP) to connect directly with other
Wi-Fi devices on different RF channels (Wi-Fi networks)
Different provisioning methods for in-home
devices - connect to Wi-Fi in one step
Low Wi-Fi power consumption in connected idle (<800 µA)
Configurable wake-on-WLAN filters to only wake up the system