SCDS430A December   2020  – May 2021 TS3DV642-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 High-Speed Performances
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application - Demultiplexing HDMI Signals
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application - Multiplexing HDMI Signals
    4. 9.4 Systems Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RUA|42
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Automotive Q100 qualified
  • Temperature range of -40 to 105 °C (grade 2)
  • Support 6 differential or 12 single-ended signals or other differential/single ended combinations
  • Supports HDMI 1.4b / 2.0, DisplayPort 1.4 HBR2, DP++, Mipi DPHY / CPHY DSI / CSI-2, LVDS
  • Bidirectional analog mux - handles most electrical signals within 0 to 5.5 V and DC to 6 Gbps range
  • –3-dB differential BW of 5.8 GHz
  • Excellent dynamic characteristics
    • Insertion loss: –1.6 dB at 3.0 GHz
    • Return loss: –17 dB at 3.0 GHz
  • Support 1.8 V, 3.3 V or 5.0 V control logic
  • Single supply voltage of 3.3 V
  • Low active (45 μA) and standby power (6 μA)
  • IOFF protection that prevents current leakage when supply rail collapsed (VCC = 0 V)
  • ESD Performance of 3 kV HBM and 1 kV CDM
  • 42-pin, 3.5 x 9 mm, 0.5 mm pitch WQFN package with wettable flank