SLVSCF4A December   2014  – July 2016 TPS650830

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Simplified System Diagram
  2. 2 Revision History
  3. 3  Device Options
  4. 4 Pin Configuration and Functions
    1. 4.1 Pin Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Voltage Regulator Assignment and Powergood Comparator Logic Assignment (External Voltage Regulator or Load Switch) for Skylake and Kabylake Platform
      2. 6.3.2  Generic Powergood Window Comparator with Open-Drain Output
      3. 6.3.3  Powergood Window Comparator
      4. 6.3.4  3.3-V LDO and 3V3SW Load Switch
      5. 6.3.5  5-V LDO and 5VSW Load Switch
      6. 6.3.6  RTC Selector and 3.1-V LDO
      7. 6.3.7  Power Path Comparators
      8. 6.3.8  UVLO Comparators
      9. 6.3.9  Temperature Comparator
      10. 6.3.10 Low Power Mode (LPM) / Connected Standby / Instant Go of VRs
      11. 6.3.11 Enable and Powergood of VRs
      12. 6.3.12 VR4 VDDQ and LDO1 VTT Enabling
      13. 6.3.13 Converters
        1. 6.3.13.1  Power Save Mode
        2. 6.3.13.2  Voltage Regulator Startup
        3. 6.3.13.3  Powergood, Power Fault, and Emergency Power Shutdown
        4. 6.3.13.4  Current Limit
        5. 6.3.13.5  Output Discharge Feature
        6. 6.3.13.6  Output Voltage Control
        7. 6.3.13.7  Converter Low Power Mode Operation
        8. 6.3.13.8  Controller Low Power Mode Operation
        9. 6.3.13.9  Controller Internal Ramp Comparator
        10. 6.3.13.10 Undervoltage Lockout
      14. 6.3.14 Coincell Selector
        1. 6.3.14.1 Functional Description of RTC Powerpath and LDO
    4. 6.4 Device Functional Modes
      1. 6.4.1  OFF State - No VIN and No Backup Battery
      2. 6.4.2  Startup
      3. 6.4.3  Ready State
      4. 6.4.4  S5/S4 State
      5. 6.4.5  S3 State
      6. 6.4.6  S0 State
      7. 6.4.7  Standby
      8. 6.4.8  DSx State
      9. 6.4.9  Emergency Shutdown
      10. 6.4.10 Backup Battery / G3 - No VIN
    5. 6.5 Programming
      1. 6.5.1 I2C - Interface
        1. 6.5.1.1 F/S-Mode Protocol
        2. 6.5.1.2 Diagrams of I2C Protocol
    6. 6.6 Register Map
      1. 6.6.1 Registers
        1. 6.6.1.1  VENDORID Register (address = 0x00) [reset = 00100010]
        2. 6.6.1.2  REVID Register (address = 0x01) [reset = 00000000]
        3. 6.6.1.3  IRQLVL1 Register (address = 0x02) [reset = 00000000]
        4. 6.6.1.4  PWRSRCINT Register (address = 0x04) [reset = 00000000]
        5. 6.6.1.5  PMUINT Register (address = 0x05) [reset = 00000000]
        6. 6.6.1.6  RESETIRQ1 Register (address = 0x08) [reset = 00000000]
        7. 6.6.1.7  RESETIRQ2 Register (address = 0x09) [reset = 00000000]
        8. 6.6.1.8  MPMUINT Register (address = 0x0B) [reset = 00010100]
        9. 6.6.1.9  MPWRSRCINT Register (address = 0x0C) [reset = 01111000]
        10. 6.6.1.10 RESETIRQ1MASK Register (address = 0x11) [reset = 00110000]
        11. 6.6.1.11 RESETIRQ2MASK Register (address = 0x12) [reset = 00000010]
        12. 6.6.1.12 IRQLVL1msK Register (address = 0x13) [reset = 10100101]
        13. 6.6.1.13 PBCONFIG Register (address = 0x14) [reset = 00011111]
        14. 6.6.1.14 PBSTATUS Register (address = 0x15) [reset = 00000000]
        15. 6.6.1.15 PWRSTAT1 Register (address = 0x16) [reset = 00000000]
        16. 6.6.1.16 PWRSTAT2 Register (address = 0x17) [reset = 00000000]
        17. 6.6.1.17 PGMASK1 Register (address = 0x18) [reset = 00000000]
        18. 6.6.1.18 PGMASK2 Register (address = 0x19) [reset = 00000000]
        19. 6.6.1.19 VCCIOCNT Register (address = 0x30) [reset = 00001010]
        20. 6.6.1.20 V5ADS3CNT Register (address = 0x31) [reset = 00101010]
        21. 6.6.1.21 V33ADSWCNT Register (address = 0x32) [reset = 00101010]
        22. 6.6.1.22 V33APCHCNT Register (address = 0x33) [reset = 00001010]
        23. 6.6.1.23 V18ACNT Register (address = 0x34) [reset = 00101010]
        24. 6.6.1.24 V18U25UCNT Register (address = 0x35) [reset = 00001010]
        25. 6.6.1.25 V1P2UCNT Register (address = 0x36) [reset = 00111010]
        26. 6.6.1.26 V100ACNT Register (address = 0x37) [reset = 00011010]
        27. 6.6.1.27 V085ACNT Register (address = 0x38) [reset = 00101010]
        28. 6.6.1.28 VRMODECTRL Register (address = 0x3B) [reset = 00111111]
        29. 6.6.1.29 DISCHCNT1 Register (address = 0x3C) [reset = 00000000]
        30. 6.6.1.30 DISCHCNT2 Register (address = 0x3D) [reset = 00000000]
        31. 6.6.1.31 DISCHCNT3 Register (address = 0x3E) [reset = 00000000]
        32. 6.6.1.32 DISCHCNT4 Register (address = 0x3F) [reset = 00000000]
        33. 6.6.1.33 PWRGDCNT1 Register (address = 0x40) [reset = 01011111 ]
        34. 6.6.1.34 VREN Register (address = 0x41) [reset = 00000000]
        35. 6.6.1.35 REGLOCK Register (address = 0x42) [reset = 00000000]
        36. 6.6.1.36 VRENPINMASK Register (address = 0x43) [reset = 00000000]
        37. 6.6.1.37 RSTCTRL Register (address = 0x48) [reset = 00011100]
        38. 6.6.1.38 SDWNCTRL Register (address = 0x49) [reset = 00000000]
        39. 6.6.1.39 VDLMTCRT Register (address = 0x51) [reset = 00000101]
        40. 6.6.1.40 ACOKDBDM Register (address = 0x69) [reset = 00001111]
        41. 6.6.1.41 LOWBATTDET Register (address = 0x6A) [reset = 11111000]
        42. 6.6.1.42 SPWRSRCINT Register (address = 0x6F) [reset = 00000000]
        43. 6.6.1.43 CLKCTRL1 Register (address = 0xD0) [reset = 00000000]
        44. 6.6.1.44 COMPA_REF Register (address = 0xDD) [reset = 00000000]
        45. 6.6.1.45 COMPB_REF Register (address = 0xDE) [reset = 00000000]
        46. 6.6.1.46 COMPC_REF Register (address = 0xDF) [reset = 00000000]
        47. 6.6.1.47 COMPD_REF Register (address = 0xE0) [reset = 00000000]
        48. 6.6.1.48 COMPE_REF Register (address = 0xE1) [reset = 00000000]
        49. 6.6.1.49 COMPF_REF Register (address = 0xE2) [reset = 00000000]
        50. 6.6.1.50 COMPG_REF Register (address = 0xE3) [reset = 00000000]
        51. 6.6.1.51 COMPH_REF Register (address = 0xE4) [reset = 00000000]
        52. 6.6.1.52 PWFAULT_MASK1 Register (address = 0xE5) [reset = 00000000]
        53. 6.6.1.53 PWFAULT_MASK2 Register (address = 0xE6) [reset = 00000000]
        54. 6.6.1.54 PGOOD_STAT1 Register (address = 0xE7) [reset = 00000000]
        55. 6.6.1.55 PGOOD_STAT2 Register (address = 0xE8) [reset = 00000000]
        56. 6.6.1.56 MISC_BITS Register (address = 0xE9) [reset = 00010000]
        57. 6.6.1.57 STDBY_CTRL Register (address = 0xEA) [reset = 11111110]
        58. 6.6.1.58 TEMPCRIT Register (address = 0xEB) [reset = 00000000]
        59. 6.6.1.59 TEMPHOT Register (address = 0xEC) [reset = 00000000]
        60. 6.6.1.60 VREN_PIN_OVR Register (address = 0xEE) [reset = 00000000]
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Controller Design Procedure
          1. 7.2.2.1.1 Selecting the Inductor
          2. 7.2.2.1.2 Selecting the Output Capacitors
          3. 7.2.2.1.3 Selecting the FETs
          4. 7.2.2.1.4 Bootstrap Capacitor
          5. 7.2.2.1.5 Setting the Current Limits
          6. 7.2.2.1.6 Selecting the Input Capacitors
        2. 7.2.2.2 Converter Design Procedure
          1. 7.2.2.2.1 Selecting the Inductor
          2. 7.2.2.2.2 Selecting the Output Capacitors
          3. 7.2.2.2.3 Selecting the Input Capacitors
        3. 7.2.2.3 LDO Design Procedure
        4. 7.2.2.4 Board Temperature Monitoring Design Procedure
        5. 7.2.2.5 Power Path Design Procedure
      3. 7.2.3 Application Performance Curves
      4. 7.2.4 Specific Application - TPS650830 Powering the Intel SkyLake and Kabylake Platform Volume Configuration
        1. 7.2.4.1 Design Requirements
        2. 7.2.4.2 Detailed Design Procedure
          1. 7.2.4.2.1 Output Inductance and Capacitance
        3. 7.2.4.3 Application Performance Curves
    3. 7.3 System Example
    4. 7.4 Do's and Don'ts
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Fanout for ZAJ using Type 4 Routing
      2. 9.1.2 Fanout for ZCG using Type 3 Routing
      3. 9.1.3 Layout Checklist
    2. 9.2 Layout Example
      1. 9.2.1 Controller Layout
      2. 9.2.2 ZAJ Package
      3. 9.2.3 ZCG Package
    3. 9.3 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Device Overview

1.1 Features

  • 5 Reconfigurable Voltage Regulators:
    • High Efficiency over a Wide Input Voltage and Wide Output Current Range
    • Voltage, Current, and Sequence can be Changed to Optimize the System
    • 4 Variable Output Voltage Step-Down Controllers using External Power MOSFETs:
      • VR1 = 1 V; VR3 = 3.3 V , VR4 = 1.2 V/1.35 V/1.1 V for DDRx VDDQ , VR5 = 5 V
      • VIN Range from 5.4 V to 24 V
    • 1 Variable Output Voltage Step-Down Converter with Internal Power MOSFETs:
      • VR2 = 1.8 V
      • VIN Range from 3 V to 3.6 V
      • Up to 2 A of Continuous Output Current
    • Output Voltage DC Accuracy ±1%; with Differential Output Voltage Sensing
    • Ultra Low Quiescent Current Mode, Typical 30-µA Quiescent Current per Controller or Converter
  • 3 Fixed LDO Voltage Regulators:
    • LDO1: Fixed Output Voltage LDO for DDRx VTT (Vout = VDDQ/2)
      • Up to 1 A of Continuous Output Current, DC+AC Accuracy ±5%, 2 A Peak
    • LDO3: 3.3-V Fixed Output Voltage LDO, DC Accuracy ±1%, < 40 mA
      • High Precision Reference Supply for External ADC
      • 3.3-V Load Switch for EC_VCC Rail
    • LDO5: 5-V Fixed Output Voltage LDO, DC Accuracy ±1%, < 100 mA
      • Automatic Switch to 5-V Regulator for Higher Efficiency
  • 7 Powergood Comparators and Sequence Logic for External Voltage Regulators, Load Switches, or LDOs
  • Power-Button Logic Supported with Programmable Response Time
  • 3 General Purpose Level Shifters
  • Backup Battery / 3.1-V LDO Selector Output for RTC
  • Power Source Detection and Monitoring: Adapter, Battery1, Battery2
  • Board Temperature Monitoring
  • 1-Hz EC-Wake Clock Output
  • Advanced System Reset Control
  • I2C Interface: Standard-Mode (100 kHz), Fast-Mode (400 kHz), Fast-Mode Plus (1000 kHz)

1.2 Applications

  • NVDC or Non-NVDC 2, 3, or 4 Series-Cell Li Battery Powered Products
  • Tablet, Ultrabook, 2in1, and Notebook Computers
  • Mobile PC's, All-in-Ones, Mobile Internet Devices

1.3 Description

The TPS650830 is a single-chip solution Power Management IC designed specifically for the latest Intel Processors targeted for Tablets, Ultrabooks, and Notebooks with NVDC or non-NVDC power architectures, using 2S, 3S, or 4S Lithium-Ion battery packs.

The TPS650830 is used for Volume systems with the low voltage rails merged for the smallest footprint and lowest cost system power solution.

The TPS650830 can provide the complete power solution based on the Intel Reference Designs. Five highly efficient step-down voltage regulators (VRs) and a sink/source LDO, are used along with power-up sequence logic managing external load switches to provide the proper power rails, sequencing, and protection - including DDR3 and DDR4 memory power. The regulators support dynamic voltage scaling (DVS) for maximum efficiency including Connected Standby. The high frequency voltage regulators use small inductors and capacitors to achieve a small solution size. Output power is adjustable on four VR controllers. An I2C interface allows simple control by the embedded controller (EC). Each version is available in a 7x7 NFBGA package and a 9x9 NFBGA package. The 7x7 NFBGA package can be used in Type 4 PCB boards for the smallest area implementation. The 9x9 NFBGA package can be used in Type 3 and Type 4 PCB boards allowing to minimize cost and area.

For the Skylake and Kabylake Power Map implementation, the five PMIC voltage regulators and LDO1 are assigned with the low-voltage rails merged or split according to the configuration. For the Volume (merged low voltage rails) configuration six external load switches are controlled and monitored by using six powergood comparator logic blocs.

Device Information (1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TPS650830 NFBGA (168) 7.00 mm x 7.00 mm
NFBGA (159) 9.00 mm x 9.00 mm
(1) For more information, see Section 11, Mechanical Packaging and Orderable Information.

1.4 Simplified System Diagram

TPS650830 TPS650830_SLVSCF4_Holistic.gif Figure 1-1 Simplified System Diagram