SLVSCL4B August   2014  – September 2014 TPS22994

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Recommended Operating Conditions
    2. 8.2 Absolute Maximum Ratings
    3. 8.3 Handling Ratings
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics, VBIAS = 7.2 V
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Operating Frequency
      2. 9.3.2  SDA/SCL Pin Configuration
      3. 9.3.3  Address (ADDx) Pin Configuration
      4. 9.3.4  On-Delay Control
      5. 9.3.5  Slew Rate Control
      6. 9.3.6  Quick Output Discharge (QOD) Control
      7. 9.3.7  Mode Registers
      8. 9.3.8  SwitchALL™ Command
      9. 9.3.9  VDD Supply For I2C Operation
      10. 9.3.10 Input Capacitor (Optional)
      11. 9.3.11 Output Capacitor (Optional)
      12. 9.3.12 I2C Protocol
        1. 9.3.12.1 Start and Stop Bit
        2. 9.3.12.2 Auto-increment Bit
        3. 9.3.12.3 Write Command
        4. 9.3.12.4 Read Command
        5. 9.3.12.5 SwitchALLTM Command
    4. 9.4 Device Functional Modes
      1. 9.4.1 I2C Control
      2. 9.4.2 GPIO Control
    5. 9.5 Register Map
  10. 10Applications and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Input Capacitor (Optional)
      2. 10.1.2 Output Capacitor (Optional)
      3. 10.1.3 Switch from GPIO Control to I2C Control (and vice versa)
      4. 10.1.4 Configuration of Configuration Registers
        1. 10.1.4.1 Single Register Configuration
        2. 10.1.4.2 Multi-register Configuration (Consecutive Registers)
      5. 10.1.5 Configuration of Mode Registers
      6. 10.1.6 Turn-on/Turn-off of Channels
    2. 10.2 Typical Application
      1. 10.2.1 Tying Multiple Channels in Parallel
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Cold Boot Programming of All Registers
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
      3. 10.2.3 Power Sequencing Without I2C
        1. 10.2.3.1 Design Requirements
          1. 10.2.3.1.1 Reading From the Registers
        2. 10.2.3.2 Detailed Design Procedure
          1. 10.2.3.2.1 VIN to VOUT Voltage Drop
          2. 10.2.3.2.2 Inrush Current
        3. 10.2.3.3 Application Curves
  11. 11Layout
    1. 11.1 Board Layout
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Input Voltage: 1.0 V to 3.6 V
  • Low ON-State Resistance (VBIAS = 7.2 V)
    • RON = 41 mΩ at VIN = 3.3 V
    • RON = 41 mΩ at VIN = 1.8 V
    • RON = 41 mΩ at VIN = 1.5 V
    • RON = 41 mΩ at VIN = 1.0 V
  • VBIAS voltage range: 2.7 V to 17.2 V
    • Suitable for 1S/2S/3S/4S Li-ion Battery Topologies
  • 1-A Max Continuous Current Per Channel
  • Quiescent Current
    • Single Channel < 12 µA
    • All Four Channels < 22 µA
  • Shutdown Current (All Four Channels) < 7 µA
  • Four 1.2-V Compatible GPIO Control Inputs
  • I2C Configuration (Per Channel)
    • On/Off Control
    • Programmable Slew Rate Control (5 options)
    • Programmable ON-delay (4 options)
    • Programmable Output Discharge (4 options)
  • I2C SwitchALL™ Command for Multi-channel/Multi-chip Control
  • QFN-20 package, 3 mm x 3 mm, 0.75 mm height

2 Applications

  • Ultrathin PC
  • Notebook PC
  • Tablets
  • Servers
  • All-In-One PC

3 Description

The TPS22994 is a multi-channel, low RON load switch with user programmable features. The device contains four N-channel MOSFETs that can operate over an input voltage range of 1.0 V to 3.6 V. The switch can be controlled by I2C making it ideal for usage with processors that have limited GPIO available. The rise time of the TPS22994 device is internally controlled in order to avoid inrush current. The TPS22994 has five programmable slew rate options, four ON-delay options, and four quick output discharge (QOD) resistance options.

The channels of the device can be controlled via either GPIO or I2C. The default mode of operation is GPIO control through the ONx terminals. The I2C slave address terminals can be tied high or low to assign seven unique device addresses.

The TPS22994 is available in a space-saving RUK package (0.4-mm pitch) and is characterized for operation over the free-air temperature range of –40°C to 85°C.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TPS22994 WQFN (20) 3.00 mm x 3.00 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

4 Simplified Schematic

typ_appv2_slvscl4.gif