SBOS755 October   2016 TLV2376 , TLV376 , TLV4376

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: TLV376
    5. 6.5 Thermal Information: TLV2376
    6. 6.6 Thermal Information: TLV4376
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Capacitive Load and Stability
      3. 7.3.3 Input Offset Voltage and Input Offset Voltage Drift
      4. 7.3.4 Common-Mode Voltage Range
      5. 7.3.5 Input and ESD Protection
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Operating Characteristics
      2. 8.1.2 Basic Amplifier Configurations
      3. 8.1.3 Active Filtering
      4. 8.1.4 Driving an Analog-to-Digital Converter
      5. 8.1.5 Phantom-Powered Microphone
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
        3. 11.1.1.3 WEBENCH® Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Low Noise: 8 nV/√Hz at 1 kHz
  • 0.1-Hz to 10-Hz Noise: 1.6 μVPP
  • Quiescent Current: 815 μA (typical)
  • Low Offset Voltage (typical):
    • Single and Dual Versions: 40 μV
    • Quad Version: 50 μV
  • Gain Bandwidth Product: 5.5 MHz
  • Rail-to-Rail Input and Output
  • Single-Supply Operation
  • Supply Voltage: 2.2 V to 5.5 V
  • Industry-Standard Packages:
    • SOT-23, SOIC, VSSOP, TSSOP

Applications

  • Solar Inverters
  • Medical Instrumentation
  • ADC Buffers
  • Handheld Test Equipment
  • Active Filtering
  • Sensor Conditioning

Description

The TLVx376 family represents a new generation of low-noise operational amplifiers with e-trim™, offering both excellent dc precision and ac performance. Rail-to-rail input and output, low offset (125 μV, maximum), low noise (8 nV/√Hz), a quiescent current of 1.2 mA (maximum), and a 5.5-MHz bandwidth with a fast slew rate of 2 V/μs make this family of devices very attractive for a variety of precision and portable applications. In addition, these devices have a reasonably wide supply range with excellent PSRR, making the family ideal for applications that run directly from batteries without regulation.

The TLV376 (single version) is available in SOT-23-5 and SOIC-8 packages. The TLV2376 (dual) is offered in VSSOP-8 and SOIC-8 packages. The TLV4376 (quad) is offered in a TSSOP-14 package. All versions are specified for operation from –40°C to +125°C.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TLV376 SOIC (8) 4.90 mm × 3.91 mm
SOT-23 (5) 2.90 mm × 1.60 mm
TLV2376 SOIC (8) 4.90 mm × 3.91 mm
VSSOP (8) 3.00 mm × 3.00 mm
TLV4376 PW (14) 5.00 mm × 4.40 mm
  1. For all available packages, see the package option addendum at the end of the data sheet.
TLV376 TLV2376 TLV4376 pg1_plots_sbos755.gif

Revision History

DATE REVISION NOTES
October 2016 * Initial release.