SLOS351E February   2004  – November 2016 TLV271 , TLV272 , TLV274

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Recommended Operating Conditions
    3. 7.3  Thermal Information: TLV271
    4. 7.4  Thermal Information: TLV272
    5. 7.5  Thermal Information: TLV274
    6. 7.6  Electrical Characteristics: DC Characteristics
    7. 7.7  Electrical Characteristics: Input Characteristics
    8. 7.8  Electrical Characteristics: Output Characteristics
    9. 7.9  Electrical Characteristics: Power Supply
    10. 7.10 Electrical Characteristics: Dynamic Performance
    11. 7.11 Electrical Characteristics: Noise/Distortion Performance
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail to Rail Output
      2. 8.3.2 Offset Voltage
      3. 8.3.3 Driving a Capacitive Load
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 System Examples
      1. 9.3.1 General Configurations
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resource
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Rail-to-Rail Output
  • Wide Bandwidth: 3 MHz
  • High Slew Rate: 2.4 V/µs
  • Supply Voltage Range: 2.7 V to 16 V
  • Supply Current: 550 µA/Channel
  • Input Noise Voltage: 39 nV/√Hz
  • Input Bias Current: 1 pA
  • Specified Temperature Range:
    • Commercial Grade: 0°C to 70°C
    • Industrial Grade: −40°C to 125°C
  • Ultrasmall Packaging:
    • 5-Pin SOT-23 (TLV271)
    • 8-Pin MSOP (TLV272)
  • Ideal Upgrade for TLC72x Family

2 Applications

  • E-Bike
  • Power Banks
  • Smoke detectors
  • Solar Inverters
  • Low-Power Motor Controls
  • Battery-Powered Instruments
  • Building Automation

Operational Amplifier

TLV271 TLV272 TLV274 front_bd_los351.gif

3 Description

Operating from 2.7 V to 16 V over the extended industrial temperature range from -40°C to +125°C, the TLV27x is a low power, wide bandwidth operational amplifier (opamp) with rail to rail output. This makes it an ideal alternative to the TLC27x family for applications where rail-to-rail output swings are essential. The TLV27x provides 3-MHz bandwidth from only 550 µA.

Like the TLC27x, the TLV27x is fully specified for 5-V and ±5-V supplies. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from a variety of rechargeable cells (±8 V supplies down to ±1.35 V).

The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making an attractive alternative for the TLC27x in battery-powered applications.

All members are available in PDIP and SOIC with the singles in the small SOT-23 package, duals in the MSOP, and quads in the TSSOP package.

The 2.7-V operation makes it compatible with Li-Ion powered systems and the operating supply voltage range of many micropower microcontrollers available today including TI’s MSP430.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TLV271 SOIC (8) 4.98 mm × 3.91 mm
SOT-23 (5) 2.90 mm × 1.60 mm
PDIP (8) 9.81 mm × 6.35 mm
TLV272 SOIC (8) 4.98 mm × 3.91 mm
PDIP (8) 9.81 mm × 6.35 mm
VSSOP (8) 3.00 mm × 3.00 mm
TLV274 SOIC (14) 8.65 mm × 3.91 mm
PDIP (14) 3.90 mm × 6.35 mm
TSSOP (14) 5.00 mm × 4.40 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.