SLLSEY3E May   2018  – May 2019 THVD1410 , THVD1450 , THVD1451 , THVD1452

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      THVD1410 and THVD1450 Simplified Schematic
      2.      THVD1451 Simplified Schematic
      3.      THVD1452 Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
    3.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  ESD Ratings [IEC]
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Power Dissipation
    7. 7.7  Electrical Characteristics
    8. 7.8  Switching Characteristics
    9. 7.9  Typical Characteristics: All Devices
    10. 7.10 Typical Characteristics: THD1450, THVD1451 and THVD1452
    11. 7.11 Typical Characteristics: THVD1410
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Functional Modes for THVD1410 and THVD1450
      2. 9.4.2 Device Functional Modes for THVD1451
      3. 9.4.3 Device Functional Modes for THVD1452
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Data Rate and Bus Length
        2. 10.2.1.2 Stub Length
        3. 10.2.1.3 Bus Loading
        4. 10.2.1.4 Receiver Failsafe
        5. 10.2.1.5 Transient Protection
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
    2. 13.2 Third-Party Products Disclaimer
    3. 13.3 Related Links
    4. 13.4 Receiving Notification of Documentation Updates
    5. 13.5 Community Resources
    6. 13.6 Trademarks
    7. 13.7 Electrostatic Discharge Caution
    8. 13.8 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Meets or Exceeds the Requirements of the TIA/EIA-485A Standard
  • 3 V to 5.5 V Supply Voltage
  • Differential Output Exceeds 2.1 V for PROFIBUS Compatibility with 5-V Supply
  • Bus I/O ESD Protection
    • ±30 kV HBM
    • ±18 kV IEC 61000-4-2 Contact Discharge
    • ±25 kV IEC 61000-4-2 Air-Gap Discharge
    • ±4 kV IEC 61000-4-4 Fast Transient Burst
  • Extended Operational Common-mode
    Range: ±15 V
  • Low EMI 500 kbps and 50 Mbps Data Rates
  • Large Receiver Hysteresis for Noise Rejection
  • Low Power Consumption
    • Standby Supply Current: < 1 µA
    • Current During Operation: < 3 mA
  • Extended Ambient Temperature
    Range: –40°C to 125°C
  • Glitch-Free Power-Up/Down for Hot Plug-in Capability
  • Open, Short, and Idle Bus Failsafe
  • 1/8 Unit Load (Up to 256 Bus Nodes)
  • Small-Size VSON and VSSOP Packages Save Board Space or SOIC for Drop-in Compatibility