SLLSEQ7E December   2015  – December 2019 TCAN330 , TCAN330G , TCAN332 , TCAN332G , TCAN334 , TCAN334G , TCAN337 , TCAN337G

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Block Diagram
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
    8. 8.8 Typical Characteristics, TCAN330 Receiver
    9. 8.9 Typical Characteristics, TCAN330 Driver
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 TXD Dominant Timeout (TXD DTO)
      2. 10.3.2 RXD Dominant Timeout (RXD DTO)
      3. 10.3.3 Thermal Shutdown
      4. 10.3.4 Undervoltage Lockout and Unpowered Device
      5. 10.3.5 Fault Pin (TCAN337)
      6. 10.3.6 Floating Pins
      7. 10.3.7 CAN Bus Short Circuit Current Limiting
      8. 10.3.8 ESD Protection
      9. 10.3.9 Digital Inputs and Outputs
    4. 10.4 Device Functional Modes
      1. 10.4.1 CAN Bus States
      2. 10.4.2 Normal Mode
      3. 10.4.3 Silent Mode
      4. 10.4.4 Standby Mode with Wake
      5. 10.4.5 Bus Wake via RXD Request (BWRR) in Standby Mode
      6. 10.4.6 Shutdown Mode
      7. 10.4.7 Driver and Receiver Function Tables
  11. 11Application and Implementation
    1. 11.1 Application Information
      1. 11.1.1 Bus Loading, Length and Number of Nodes
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 CAN Termination
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
    3. 11.3 System Examples
      1. 11.3.1 ISO11898 Compliance of TCAN33x Family of 3.3-V CAN Transceivers Introduction
      2. 11.3.2 Differential Signal
      3. 11.3.3 Common-Mode Signal and EMC Performance
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Related Links
    2. 14.2 Support Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • 3.3-V Single supply operation
  • Data rates up to 5 Mbps (TCAN33xG devices)
  • Compatible with ISO 11898-2
  • SOIC-8 and SOT-23 package options
  • Operatinles:
    • Normal mode (all devices)
    • Low power standby mode with wake (TCAN334)
    • Silent mode (TCAN330, TCAN337)
    • Shutdown mode (TCAN330, TCAN334)
  • Wide common mode range of operation ±12 V
  • Bus pin fault protection of ±14 V
  • Total loop delay < 135 ns
  • Wide ambient operation temperature range: –40°C to 125°C
  • Optimized behavior when unpowered:
    • Bus and logic pins are high impedance (no load to operating bus or application)
    • Power up / down glitch free operation
  • Excellent EMC performance
  • Protection features:
    • ESD Protection of bus terminals
      • HBM ESD Protection exceeds ±25 kV
      • IEC61000-4-2 ESD Contact discharge protection exceeds ±12 kV
    • Driver dominant time out (TXD DTO)
    • Receiver dominant time out (RXD DTO)
    • Fault output pin (TCAN337 only)
    • Undervoltage protection on VCC
    • Thermal shutdown protection
    • Current limiting on bus pins