SLLSEI2A September   2017  – December 2017 SN55HVD233-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Driver Electrical Characteristics
    6. 7.6  Receiver Electrical Characteristics
    7. 7.7  Driver Switching Characteristics
    8. 7.8  Receiver Switching Characteristics
    9. 7.9  Device Switching Characteristics
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Modes
      2. 9.3.2 Loopback
      3. 9.3.3 CAN Bus States
      4. 9.3.4 ISO 11898 Compliance of SN55HVD233-SP
        1. 9.3.4.1 Introduction
        2. 9.3.4.2 Differential Signal
          1. 9.3.4.2.1 Common-Mode Signal
        3. 9.3.4.3 Interoperability of 3.3-V CAN in 5-V CAN Systems
      5. 9.3.5 Thermal Shutdown
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Diagnostic Loopback
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Slope Control
        2. 10.2.2.2 Standby
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Bus Loading, Length, and Number of Nodes
      2. 12.1.2 CAN Termination
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • HKX|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • QMLV (QML Class V) Radiation Hardness Assured (RHA) MIL-PRF 38535 Qualified, SMD 5962L1420901VXC
    • Single Event Latch-up (SEL) Immune to 86 MeV-cm2/mg at 125°C
    • Total Ionizing Dose (TID) immune up 50 kRad (Si) at Low Dose Rate
    • Qualified over the Military Temperature Range (–55°C to 125°C)
    • High-Performance 8-Pin Ceramic Flat Pack (HKX)
  • Compatible With ISO 11898-2
  • Bus Pins Fault Protection Exceeds ±16 V
  • Bus Pins ESD Protection Exceeds ±16 kV HBM
  • Data Rates up to 1 Mbps
  • Extended –7-V to 12-V Common Mode Range
  • High Input Impedance Allows for 120 Nodes
  • LVTTL I/Os are 5-V Tolerant
  • Adjustable Driver Transition Times for Improved Signal Quality
  • Unpowered Node Does Not Disturb the Bus
  • Low Current Standby Mode, 200-μA Typical
  • Loopback for Diagnostic Functions
  • Thermal Shutdown Protection
  • Power Up and Power Down With Glitch-Free Bus Inputs and Outputs
    • High Input Impedance With Low VCC
    • Monolithic Output During Power Cycling

2 Applications

  • Spacecraft Backplane Data Bus Communication and Control
  • CAN Bus Standards Such As CANopen, DeviceNet, CAN Kingdom, ISO 11783, NMEA 2000, SAE J1939

3 Description

The SN55HVD233-SP is used in spacecraft applications employing the controller area network (CAN) serial communication physical layer in accordance with the ISO 11898 standard. As a CAN transceiver, the device provides transmit and receive capability between the differential CAN bus and a CAN controller, with signaling rates up to 1 Mbps.

Designed for operation in especially harsh radiation environments, the SN55HVD233-SP features cross-wire, overvoltage, and loss of ground protection to ±16 V, overtemperature (thermal shutdown) protection. This device operates over a wide –7-V to 12-V common mode range. This transceiver is the interface between the host CAN controller on the microprocessor, FPGA, or ASIC, and the differential CAN bus used in satellite applications.

Device Information(1)

PART NUMBER GRADE PACKAGE
5962L1420901VXC QMLV RHA
[50 kRad]		 8-lead CFP [HKX]
6.48 mm × 6.48 mm
HVD233HKX/EM(2) Engineering Samples 8-lead CFP [HKX]
6.48 mm × 6.48 mm
SN55HVD233EVM-CVAL Ceramic Evaluation Board
  1. For all available packages, see the orderable addendum at the end of the data sheet.
  2. These units are intended for engineering evaluation only. They are processed to a noncompliant flow. These units are not suitable for qualification, production, radiation testing or flight use. Parts are not warranted for performance over the full MIL specified temperature range of –55°C to 125°C or operating life.

Simplified Schematic

SN55HVD233-SP Block_Diagram_sllsei2.gif