SBVS032I March   2002  – July 2022

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Supply Voltage
      2. 8.3.2 Thermal Hysteresis
      3. 8.3.3 Temperature Drift
      4. 8.3.4 Noise Performance
      5. 8.3.5 Long-Term Stability
      6. 8.3.6 Load Regulation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Negative Reference Voltage
      2. 8.4.2 Data Acquisition
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • microSize Package: SOT-23-3
  • Low Dropout: 1 mV
  • High Output Current: 25 mA
  • High Accuracy: 0.2%
  • Low IQ: 42 µA (Typical)
  • Excellent Specified Drift Performance:
    • 50 ppm/°C (Maximum) From 0°C to 70°C
    • 75 ppm/°C (Maximum) From –40°C to +125°C