SBOS771A
December 2016 – January 2019
OPA4277-SP
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Simplified Schematic
4
Revision History
5
Pin Configuration and Functions
Pin Functions: CFP
Pin Functions: CDIP
5.1
Bare Die Information
Bond Pad Coordinates in Microns
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Input Protection
7.3.2
Input Bias Current Cancellation
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Receiving Notification of Documentation Updates
11.2
Community Resources
11.3
Trademarks
11.4
Electrostatic Discharge Caution
11.5
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
HFR|14
MCCF003
JDJ|28
MCDI050
KGD|0
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbos771a_oa
sbos771a_pm
1
Features
QMLV Qualified:
5962-16209
Radiation Hardness Assurance (RHA) up to Total Ionizing Dose (TID) 50 krad(Si)
ELDRS-Free (See
Radiation Report
)
Single Event Latchup (SEL) Immune to LET = 85 MeV-cm
2
/mg
Ultra-Low Offset Voltage: 20 µV
Ultra-Low Drift: ±0.15 µV/°C
High Open-Loop Gain: 134 dB
High Common-Mode Rejection: 140 dB
High-Power Supply Rejection: 130 dB
Wide Supply Range: ±2 to ±18 V
Low-Quiescent Current: 800 µA/Amplifier
Available in 14-lead CFP With Industry Standard Quad Operational Amplifier Pinout