SNAS849
December 2024
LMX2624-SP
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Timing Requirements
5.7
Timing Diagrams
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Reference Oscillator Input
6.3.2
Reference Path
6.3.2.1
OSCin Doubler (OSC_2X)
6.3.2.2
Pre-R Divider (PLL_R_PRE)
6.3.2.3
Post-R Divider (PLL_R)
6.3.3
State Machine Clock
6.3.4
PLL Phase Detector and Charge Pump
6.3.5
N Divider and Fractional Circuitry
6.3.6
MUXout Pin
6.3.6.1
Serial Data Output for Readback
6.3.6.2
Lock Detect Indicator Set as Type “VCOcal” or "Vtune and VCOcal"
6.3.7
VCO (Voltage-Controlled Oscillator)
6.3.7.1
VCO Calibration
6.3.7.1.1
Double Buffering (Shadow Registers)
6.3.7.2
Watchdog Feature
6.3.7.3
RECAL Feature
6.3.7.4
Determining the VCO Gain
6.3.8
Channel Divider
6.3.9
Output Mute Pin and Ping Pong Approaches
6.3.10
Output Frequency Doubler
6.3.11
Output Buffer
6.3.12
Power-Down Modes
6.3.13
Pin-Mode Integer Frequency Generation
6.3.14
Treatment of Unused Pins
6.3.15
Phase Synchronization
6.3.15.1
General Concept
6.3.15.2
Categories of Applications for SYNC
6.3.15.3
Procedure for Using SYNC
6.3.15.4
SYNC Input Pin
6.3.16
Phase Adjust
6.3.17
Fine Adjustments for Phase Adjust and Phase SYNC
6.3.18
SYSREF
6.3.18.1
Programmable Fields
6.3.18.2
Input and Output Pin Formats
6.3.18.2.1
SYSREF Output Format
6.3.18.3
Examples
6.3.18.4
SYSREF Procedure
6.4
Device Functional Modes
6.5
Programming
6.5.1
Recommended Initial Power-Up Sequence
6.5.2
Recommended Sequence for Changing Frequencies
7
Register Maps
7.1
Device Registers
8
Application and Implementation
8.1
Application Information
8.1.1
OSCin Configuration
8.1.2
OSCin Slew Rate
8.1.3
RF Output Buffer Power Control
8.1.4
RF Output Buffer Pullup
8.1.5
RF Output Treatment for the Complimentary Side
8.1.5.1
Single-ended Termination of Unused Output
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
8.4.3
Footprint Example on PCB Layout
8.4.4
Radiation Environments
8.4.4.1
Total Ionizing Dose
8.4.4.2
Single Event Effect
9
Device and Documentation Support
9.1
Device Support
9.1.1
Development Support
9.2
Documentation Support
9.2.1
Related Documentation
9.3
Receiving Notification of Documentation Updates
9.4
Support Resources
9.5
Trademarks
9.6
Electrostatic Discharge Caution
9.7
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
11.1
Engineering Samples
11.2
Package Option Addendum
11.3
Tape and Reel Information
Package Options
Mechanical Data (Package|Pins)
PAP|64
MPQF071C
Thermal pad, mechanical data (Package|Pins)
Data Sheet
LMX2624-SP
5MHz to 28GHz Wideband Synthesizer With Phase Synchronization and JESD204B/C Support