SNAS605AS
March 2013 – May 2020
LMK04821
,
LMK04826
,
LMK04828
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Simplified Schematic
4
Revision History
5
Device Comparison Table
5.1
Device Configuration Information
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
SPI Interface Timing
7.7
Typical Characteristics – Clock Output AC Characteristics
8
Parameter Measurement Information
8.1
Charge Pump Current Specification Definitions
8.1.1
Charge Pump Output Current Magnitude Variation Vs. Charge Pump Output Voltage
8.1.2
Charge Pump Sink Current Vs. Charge Pump Output Source Current Mismatch
8.1.3
Charge Pump Output Current Magnitude Variation Vs. Ambient Temperature
8.2
Differential Voltage Measurement Terminology
9
Detailed Description
9.1
Overview
9.1.1
Jitter Cleaning
9.1.2
JEDEC JESD204B Support
9.1.3
Three PLL1 Redundant Reference Inputs
9.1.4
VCXO/Crystal Buffered Output
9.1.5
Frequency Holdover
9.1.6
PLL2 Integrated Loop Filter Poles
9.1.7
Internal VCOs
9.1.7.1
VCO1 Divider (LMK04821 only)
9.1.8
External VCO Mode
9.1.9
Clock Distribution
9.1.9.1
Device Clock Divider
9.1.9.2
SYSREF Clock Divider
9.1.9.3
Device Clock Delay
9.1.9.4
SYSREF Delay
9.1.9.5
Glitchless Half Step and Glitchless Analog Delay
9.1.9.6
Programmable Output Formats
9.1.9.7
Clock Output Synchronization
9.1.10
Zero-Delay
9.1.11
Status Pins
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
SYNC/SYSREF
9.3.2
JEDEC JESD204B
9.3.2.1
How To Enable SYSREF
9.3.2.1.1
Setup of SYSREF Example
9.3.2.1.2
SYSREF_CLR
9.3.2.2
SYSREF Modes
9.3.2.2.1
SYSREF Pulser
9.3.2.2.2
Continuous SYSREF
9.3.2.2.3
SYSREF Request
9.3.3
Digital Delay
9.3.3.1
Fixed Digital Delay
9.3.3.1.1
Fixed Digital Delay Example
9.3.3.2
Dynamic Digital Delay
9.3.3.3
Single and Multiple Dynamic Digital Delay Example
9.3.4
SYSREF to Device Clock Alignment
9.3.5
Input Clock Switching
9.3.5.1
Input Clock Switching - Manual Mode
9.3.5.2
Input Clock Switching - Pin Select Mode
9.3.5.3
Input Clock Switching - Automatic Mode
9.3.6
Digital Lock Detect
9.3.7
Holdover
9.3.7.1
Enable Holdover
9.3.7.1.1
Fixed (Manual) CPout1 Holdover Mode
9.3.7.1.2
Tracked CPout1 Holdover Mode
9.3.7.2
Entering Holdover
9.3.7.3
During Holdover
9.3.7.4
Exiting Holdover
9.3.7.5
Holdover Frequency Accuracy and DAC Performance
9.3.7.6
Holdover Mode - Automatic Exit of Holdover
9.4
Device Functional Modes
9.4.1
Dual PLL
9.4.2
Zero-Delay Dual PLL
9.4.3
Single-Loop Mode
9.4.4
Single-Loop Mode With External VCO
9.4.5
Distribution Mode
9.5
Programming
9.5.1
Recommended Programming Sequence
9.5.1.1
SPI LOCK
9.5.1.2
SYSREF_CLR
9.5.1.3
RESET Pin
9.6
Register Maps
9.6.1
Register Map for Device Programming
9.7
Device Register Descriptions
9.7.1
System Functions
9.7.1.1
RESET, SPI_3WIRE_DIS
9.7.1.2
POWERDOWN
9.7.1.3
ID_DEVICE_TYPE
9.7.1.4
ID_PROD[15:8], ID_PROD
9.7.1.5
ID_MASKREV
9.7.1.6
ID_VNDR[15:8], ID_VNDR
9.7.2
(0x100 - 0x138) Device Clock and SYSREF Clock Output Controls
9.7.2.1
CLKoutX_Y_ODL, CLKoutX_Y_IDL, DCLKoutX_DIV
9.7.2.2
DCLKoutX_DDLY_CNTH, DCLKoutX_DDLY_CNTL
9.7.2.3
DCLKoutX_ADLY, DCLKoutX_ADLY_MUX, DCLKout_MUX
9.7.2.4
DCLKoutX_HS, SDCLKoutY_MUX, SDCLKoutY_DDLY, SDCLKoutY_HS
9.7.2.5
SDCLKoutY_ADLY_EN, SDCLKoutY_ADLY
9.7.2.6
DCLKoutX_DDLY_PD, DCLKoutX_HSg_PD, DCLKout_ADLYg_PD, DCLKout_ADLY_PD, DCLKoutX_Y_PD, SDCLKoutY_DIS_MODE, SDCLKoutY_PD
9.7.2.7
SDCLKoutY_POL, SDCLKoutY_FMT, DCLKoutX_POL, DCLKoutX_FMT
9.7.3
SYSREF, SYNC, and Device Config
9.7.3.1
VCO_MUX, OSCout_MUX, OSCout_FMT
9.7.3.2
SYSREF_CLKin0_MUX, SYSREF_MUX
9.7.3.3
SYSREF_DIV[12:8], SYSREF_DIV[7:0]
9.7.3.4
SYSREF_DDLY[12:8], SYSREF_DDLY[7:0]
9.7.3.5
SYSREF_PULSE_CNT
9.7.3.6
PLL2_NCLK_MUX, PLL1_NCLK_MUX, FB_MUX, FB_MUX_EN
9.7.3.7
PLL1_PD, VCO_LDO_PD, VCO_PD, OSCin_PD, SYSREF_GBL_PD, SYSREF_PD, SYSREF_DDLY_PD, SYSREF_PLSR_PD
9.7.3.8
DDLYdSYSREF_EN, DDLYdX_EN
9.7.3.9
DDLYd_STEP_CNT
9.7.3.10
SYSREF_CLR, SYNC_1SHOT_EN, SYNC_POL, SYNC_EN, SYNC_PLL2_DLD, SYNC_PLL1_DLD, SYNC_MODE
9.7.3.11
SYNC_DISSYSREF, SYNC_DISX
9.7.3.12
Fixed Registers (0x145, 0x171 - 0x172)
9.7.4
(0x146 - 0x149) CLKin Control
9.7.4.1
CLKin2_EN, CLKin1_EN, CLKin0_EN, CLKin2_TYPE, CLKin1_TYPE, CLKin0_TYPE
9.7.4.2
CLKin_SEL_POL, CLKin_SEL_MODE, CLKin1_OUT_MUX, CLKin0_OUT_MUX
9.7.4.3
CLKin_SEL0_MUX, CLKin_SEL0_TYPE
9.7.4.4
SDIO_RDBK_TYPE, CLKin_SEL1_MUX, CLKin_SEL1_TYPE
9.7.5
RESET_MUX, RESET_TYPE
9.7.6
(0x14B - 0x152) Holdover
9.7.6.1
LOS_TIMEOUT, LOS_EN, TRACK_EN, HOLDOVER_FORCE, MAN_DAC_EN, MAN_DAC[9:8]
9.7.6.2
MAN_DAC[9:8], MAN_DAC[7:0]
9.7.6.3
DAC_TRIP_LOW
9.7.6.4
DAC_CLK_MULT, DAC_TRIP_HIGH
9.7.6.5
DAC_CLK_CNTR
9.7.6.6
CLKin_OVERRIDE, HOLDOVER_PLL1_DET, HOLDOVER_LOS_DET, HOLDOVER_VTUNE_DET, HOLDOVER_HITLESS_SWITCH, HOLDOVER_EN
9.7.6.7
HOLDOVER_DLD_CNT[13:8], HOLDOVER_DLD_CNT[7:0]
9.7.7
(0x153 - 0x15F) PLL1 Configuration
9.7.7.1
CLKin0_R[13:8], CLKin0_R[7:0]
9.7.7.2
CLKin1_R[13:8], CLKin1_R[7:0]
9.7.7.3
CLKin2_R[13:8], CLKin2_R[7:0]
9.7.7.4
PLL1_N
9.7.7.5
PLL1_WND_SIZE, PLL1_CP_TRI, PLL1_CP_POL, PLL1_CP_GAIN
9.7.7.6
PLL1_DLD_CNT[13:8], PLL1_DLD_CNT[7:0]
9.7.7.7
PLL1_R_DLY, PLL1_N_DLY
9.7.7.8
PLL1_LD_MUX, PLL1_LD_TYPE
9.7.8
(0x160 - 0x16E) PLL2 Configuration
9.7.8.1
PLL2_R[11:8], PLL2_R[7:0]
9.7.8.2
PLL2_P, OSCin_FREQ, PLL2_XTAL_EN, PLL2_REF_2X_EN
9.7.8.3
PLL2_N_CAL
9.7.8.4
PLL2_FCAL_DIS, PLL2_N
9.7.8.5
PLL2_WND_SIZE, PLL2_CP_GAIN, PLL2_CP_POL, PLL2_CP_TRI
9.7.8.6
SYSREF_REQ_EN, PLL2_DLD_CNT
9.7.8.7
PLL2_LF_R4, PLL2_LF_R3
9.7.8.8
PLL2_LF_C4, PLL2_LF_C3
9.7.8.9
PLL2_LD_MUX, PLL2_LD_TYPE
9.7.9
(0x16F - 0x1FFF) Misc Registers
9.7.9.1
PLL2_PRE_PD, PLL2_PD
9.7.9.2
VCO1_DIV
9.7.9.3
OPT_REG_1
9.7.9.4
OPT_REG_2
9.7.9.5
RB_PLL1_LD_LOST, RB_PLL1_LD, CLR_PLL1_LD_LOST
9.7.9.6
RB_PLL2_LD_LOST, RB_PLL2_LD, CLR_PLL2_LD_LOST
9.7.9.7
RB_DAC_VALUE(MSB), RB_CLKinX_SEL, RB_CLKinX_LOS
9.7.9.8
RB_DAC_VALUE
9.7.9.9
RB_HOLDOVER
9.7.9.10
SPI_LOCK
10
Applications and Implementation
10.1
Application Information
10.2
Digital Lock Detect Frequency Accuracy
10.2.1
Minimum Lock Time Calculation Example
10.3
Driving CLKin and OSCin Inputs
10.3.1
Driving CLKin and OSCin Pins With a Differential Source
10.3.2
Driving CLKin and OSCin Pins With a Single-Ended Source
10.4
Output Termination and Biasing
10.4.1
LVPECL
10.4.2
LVDS/HSDS
10.5
Typical Applications
10.5.1
Design Example
10.5.1.1
Design Requirements
10.5.1.2
Detailed Design Procedure
10.5.1.2.1
Device Configuration and Simulation - PLLatinum Sim
10.5.1.2.2
Device Programming
10.5.1.3
Application Curves
10.6
System Examples
10.6.1
System Level Diagram
10.7
Do's and Don'ts
11
Power Supply Recommendations
11.1
Pin Connection Recommendations
11.1.1
VCC Pins and Decoupling
11.1.1.1
Clock Output Supplies
11.1.1.2
Low-Crosstalk Supplies
11.1.1.3
PLL2 Supplies
11.1.1.4
Clock Input Supplies
11.1.1.5
Unused Clock Inputs/Outputs
11.2
Current Consumption / Power Dissipation Calculations
12
Layout
12.1
Layout Guidelines
12.1.1
Thermal Management
12.2
Layout Example
13
Device and Documentation Support
13.1
Device Support
13.1.1
Development Support
13.1.1.1
PLLatinum Sim
13.1.1.2
TICS Pro
13.2
Related Links
13.3
Trademarks
13.4
Electrostatic Discharge Caution
13.5
Glossary
14
Mechanical, Packaging, and Orderable Information
1
Features
JEDEC JESD204B Support
Ultra-Low RMS Jitter
88 fs RMS Jitter (12 kHz to 20 MHz)
91 fs RMS Jitter (100 Hz to 20 MHz)
–162.5 dBc/Hz Noise Floor at 245.76 MHz
Up to 14 Differential Device Clocks from PLL2
Up to 7 SYSREF Clocks
Maximum Clock Output Frequency 3.1 GHz
LVPECL, LVDS, HSDS, LCPECL Programmable Outputs from PLL2
Up to 1 Buffered VCXO/Crystal Output from PLL1
LVPECL, LVDS, 2xLVCMOS Programmable
Dual Loop PLLatinum™ PLL Architecture
PLL1
Up to 3 Redundant Input Clocks
Automatic and Manual Switch-Over Modes
Hitless Switching and LOS
Integrated Low-Noise Crystal Oscillator Circuit
Holdover Mode When Input Clocks are Lost
PLL2
Normalized [1 Hz] PLL Noise Floor of
–227 dBc/Hz
Phase Detector Rate up to 155 MHz
OSCin Frequency-Doubler
Two Integrated Low-Noise VCOs
50% Duty Cycle Output Divides, 1 to 32
(even and odd)
Precision Digital Delay, Dynamically Adjustable
25-ps Step Analog Delay
Multi-Mode: Dual PLL, Single PLL, and Clock Distribution
Industrial Temperature Range: –40 to 85°C
Supports 105°C PCB Temperature (Measured at Thermal Pad)
3.15-V to 3.45-V Operation
Package: 64-Pin QFN (9.0 mm × 9.0 mm × 0.8 mm)