DLPS048C
March 2015 – June 2019
DLPC150
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
DLP 0.2-Inch WVGA Chipset
4
Revision History
5
Pin Configuration and Functions
Pin Functions
5.1
DLPC150 Mechanical Data
Table 1.
I/O Type Subscript Definition
Table 2.
Internal Pullup and Pulldown Characteristics
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics Over Recommended Operating Conditions
6.6
Electrical Characteristics
6.7
High-Speed Sub-LVDS Electrical Characteristics
6.8
Low-Speed SDR Electrical Characteristics
6.9
System Oscillators Timing Requirements
6.10
Power-Up and Reset Timing Requirements
6.11
Parallel Interface Frame Timing Requirements
6.12
Parallel Interface General Timing Requirements
6.13
Flash Interface Timing Requirements
7
Parameter Measurement Information
7.1
Host_irq Usage Model
7.2
Input Source
7.2.1
Parallel Interface Supports Two Data Transfer Formats
7.2.1.1
Pdata Bus – Parallel Interface Bit Mapping Modes
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Interface Timing Requirements
8.3.1.1
Parallel Interface
8.3.2
Serial Flash Interface
8.3.3
Serial Flash Programming
8.3.4
I2C Control Interface
8.3.5
DMD (Sub-LVDS) Interface
8.3.6
Calibration And Debug Support
8.3.7
DMD Interface Considerations
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.1.1
DLPC150 System Design Consideration – Application Notes
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
DLPC150 System Interfaces
9.2.2.1.1
Control Interface
9.2.3
Application Curve
10
Power Supply Recommendations
10.1
System Power-Up and Power-Down Sequence
10.2
DLPC150 Power-Up Initialization Sequence
10.3
DMD Fast Park Control (PARKZ)
10.4
Hot Plug Usage
10.5
Maximum Signal Transition Time
11
Layout
11.1
Layout Guidelines
11.1.1
PCB Layout Guidelines For Internal Controller PLL Power
11.1.2
DLPC150 Reference Clock
11.1.2.1
Recommended Crystal Oscillator Configuration
11.1.3
General PCB Recommendations
11.1.4
General Handling Guidelines for Unused CMOS-Type Pins
11.1.5
Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
11.1.6
Number of Layer Changes
11.1.7
Stubs
11.1.8
Terminations
11.1.9
Routing Vias
11.2
Layout Example
11.3
Thermal Considerations
12
Device and Documentation Support
12.1
Device Support
12.1.1
Device Nomenclature
12.1.1.1
Device Markings
12.2
Related Links
12.3
Community Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
13.1
Package Option Addendum
13.1.1
Packaging Information
Package Options
Mechanical Data (Package|Pins)
ZEZ|201
MPBGAK7
Thermal pad, mechanical data (Package|Pins)
1
Features
Display controller required for reliable operation of the DLP2010 and DLP2010NIR DMDs
High-speed pattern sequence mode
1-Bit binary pattern rates to 2880 Hz
1-to-1 input mapping to micromirrors
Easy synchronization with cameras and sensors
One input trigger
Two output triggers
I
2
C configuration interface
Input pixel interface support:
24-bit parallel RGB888 interface protocol
16-bit parallel RGB565 interface protocol
Pixel clock up to 75 MHz
Integrated micromirror drivers
Integrated clock generation
Auto DMD parking at power down
201-pin, 13mm × 13 mm, 0.8-mm pitch, VFBGA package