SLAS425D July   2004  – October 2021 DAC5662

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Resistance Characteristics
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics
    7. 6.7  Electrical Characteristics, AC
    8. 6.8  Electrical Characteristics, DC
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Digital Inputs and Timing
      1. 7.1.1 Digital Inputs
      2. 7.1.2 Input Interfaces
      3. 7.1.3 Dual-Bus Data Interface and Timing
      4. 7.1.4 Single-Bus Interleaved Data Interface and Timing
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Transfer Function
        1. 8.3.1.1 Analog Outputs
      2. 8.3.2 Output Configurations
      3. 8.3.3 Differential With Transformer
      4. 8.3.4 Single-Ended Configuration
      5. 8.3.5 Reference Operation
        1. 8.3.5.1 Internal Reference
        2. 8.3.5.2 External Reference
      6. 8.3.6 Gain Setting Option
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode
  9. 9 Application and Implementation
    1. 9.1 Application Informmation
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PFB|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • 12-Bit dual transmit DAC
  • 275 MSPS Update rate
  • Single supply: 3 V to 3.6 V
  • High SFDR: 85 dBc at 5 MHz
  • High IMD3: 78 dBc at 15.1 and 16.1 MHz
  • WCDMA ACLR: 70 dB at 30.72 MHz
  • Independent or single resistor gain control
  • Dual or interleaved data
  • On-chip 1.2-V reference
  • Low power: 330 mW
  • Power-down mode: 15 mW
  • Package: 48-Pin TQFP