SLVSB76B
August 2012 – August 2019
TPS63036
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Typical Application Schematic
Efficiency vs Output Current
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Device Enable
7.3.2
Overvoltage Protection
7.3.3
Undervoltage Lockout
7.3.4
Overtemperature Protection
7.4
Device Functional Modes
7.4.1
Soft-Start and Short Circuit Protection
7.4.2
Buck-Boost Operation
7.4.3
Control Loop
7.4.4
Power-Save Mode and Synchronization
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Inductor Selection
8.2.2.2
Capacitor Selection
8.2.2.2.1
Input Capacitor
8.2.2.2.2
Output Capacitor
8.2.2.3
Setting the Output Voltage
8.2.2.4
Current Limit
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
10.3
Thermal Considerations
11
Device and Documentation Support
11.1
Device Support
11.1.1
Third-Party Products Disclaimer
11.2
Community Resources
11.3
Trademarks
11.4
Electrostatic Discharge Caution
11.5
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
YFG|8
MXBG085C
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slvsb76b_oa
slvsb76b_pm
1
Features
Input voltage range: 1.8 V to 5.5 V
(>2 V for device start-up)
Adjustable output voltage range: 1.2 V to 5.5 V
High efficiency over the entire load range
Operating quiescent current: 25 µA
Power save mode with seamless transition
Average current mode buck-boost architecture
Automatic transition between modes
Fixed frequency operation at 2.4 MHz
Synchronization to external clock possible
Safety and robust operation features
Overtemperature, overvoltage protection
Load disconnect during shutdown
Tiny 8-pin wafer chip scale package (WCSP): 1.814 mm × 1.076 mm