SWRS219E October   2018  – June 2021 IWR6443 , IWR6843

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions
      1. 7.2.1 Signal Descriptions - Digital
      2. 7.2.2 Signal Descriptions - Analog
    3. 7.3 Pin Attributes
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Power Supply Specifications
    6. 8.6  Power Consumption Summary
    7. 8.7  RF Specification
    8. 8.8  CPU Specifications
    9. 8.9  Thermal Resistance Characteristics for FCBGA Package [ABL0161]
    10. 8.10 Timing and Switching Characteristics
      1. 8.10.1  Power Supply Sequencing and Reset Timing
      2. 8.10.2  Input Clocks and Oscillators
        1. 8.10.2.1 Clock Specifications
      3. 8.10.3  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 8.10.3.1 Peripheral Description
        2. 8.10.3.2 MibSPI Transmit and Receive RAM Organization
          1. 8.10.3.2.1 SPI Timing Conditions
          2. 8.10.3.2.2 SPI Master Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) (1) (1)
          3. 8.10.3.2.3 SPI Master Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) (1) (1)
        3. 8.10.3.3 SPI Slave Mode I/O Timings
          1. 8.10.3.3.1 SPI Slave Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) (1) (1) (1)
        4. 8.10.3.4 Typical Interface Protocol Diagram (Slave Mode)
      4. 8.10.4  LVDS Interface Configuration
        1. 8.10.4.1 LVDS Interface Timings
      5. 8.10.5  General-Purpose Input/Output
        1. 8.10.5.1 Switching Characteristics for Output Timing versus Load Capacitance (CL) (1) (1)
      6. 8.10.6  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 8.10.6.1 Dynamic Characteristics for the CANx TX and RX Pins
      7. 8.10.7  Serial Communication Interface (SCI)
        1. 8.10.7.1 SCI Timing Requirements
      8. 8.10.8  Inter-Integrated Circuit Interface (I2C)
        1. 8.10.8.1 I2C Timing Requirements (1)
      9. 8.10.9  Quad Serial Peripheral Interface (QSPI)
        1. 8.10.9.1 QSPI Timing Conditions
        2. 8.10.9.2 Timing Requirements for QSPI Input (Read) Timings (1) (1)
        3. 8.10.9.3 QSPI Switching Characteristics
      10. 8.10.10 ETM Trace Interface
        1. 8.10.10.1 ETMTRACE Timing Conditions
        2. 8.10.10.2 ETM TRACE Switching Characteristics
      11. 8.10.11 Data Modification Module (DMM)
        1. 8.10.11.1 DMM Timing Requirements
      12. 8.10.12 JTAG Interface
        1. 8.10.12.1 JTAG Timing Conditions
        2. 8.10.12.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 8.10.12.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Subsystems
      1. 9.3.1 RF and Analog Subsystem
        1. 9.3.1.1 Clock Subsystem
        2. 9.3.1.2 Transmit Subsystem
        3. 9.3.1.3 Receive Subsystem
      2. 9.3.2 Processor Subsystem
      3. 9.3.3 Host Interface
      4. 9.3.4 Main Subsystem Cortex-R4F
      5. 9.3.5 DSP Subsystem
      6. 9.3.6 Hardware Accelerator
    4. 9.4 Other Subsystems
      1. 9.4.1 ADC Channels (Service) for User Application
        1. 9.4.1.1 GP-ADC Parameter
  10. 10Monitoring and Diagnostics
    1. 10.1 Monitoring and Diagnostic Mechanisms
      1. 10.1.1 Error Signaling Module
  11. 11Applications, Implementation, and Layout
    1. 11.1 Application Information
    2. 11.2 Reference Schematic
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
    3. 12.3 Documentation Support
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information
    2. 13.2 Tray Information for ABL, 10.4 × 10.4 mm

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ABL|161
  • ALA|209
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • FMCW transceiver
    • Integrated PLL, transmitter, receiver, Baseband, and ADC
    • 60- to 64-GHz coverage with 4-GHz continuous bandwidth
    • Four receive channels
    • Three transmit channels
    • Supports 6-bit phase shifter for TX Beam forming
    • Ultra-accurate chirp engine based on fractional-N PLL
    • TX power: 12 dBm
    • RX noise figure:
      • 12 dB
    • Phase noise at 1 MHz:
      • –93 dBc/Hz
  • Built-in calibration and self-test
    • Arm®Cortex®-R4F-based radio control system
    • Built-in firmware (ROM)
    • Self-calibrating system across frequency and temperature
    • Embedded self-monitoring with no host processor involvement on Functional Safety-Compliant devices
  • C674x DSP for advanced signal processing (IWR6843 only)
  • Hardware accelerator for FFT, filtering, and CFAR processing
  • Memory compression
  • Arm-R4F microcontroller for object detection, and interface control
    • Supports autonomous mode (loading user application from QSPI flash memory)
  • Internal memory with ECC
    • IWR6843: 1.75 MB, divided into MSS program RAM (512 KB), MSS data RAM (192 KB), DSP L1 RAM (64KB) and L2 RAM (256 KB), and L3 radar data cube RAM (768 KB)
    • IWR6443: 1.4 MB, divided into MSS program RAM (512 KB), MSS data RAM (192 KB), and L3 radar data cube RAM (768 KB)
    • Technical reference manual includes allowed size modifications
  • Other interfaces available to user application
    • Up to 6 ADC channels (low sample rate monitoring)
    • Up to 2 SPI ports
    • Up to 2 UARTs
    • 1 CAN-FD interface
    • I2C
    • GPIOs
    • 2 lane LVDS interface for raw ADC data and debug instrumentation
  • Functional Safety-Compliant
    • Developed for functional safety applications
    • Documentation available to aid IEC 61508 functional safety system design up to SIL 3
    • Hardware integrity up to SIL-2
    • Safety-related certification
  • Non-Functional safety variants also available
  • Power management
    • Built-in LDO network for enhanced PSRR
    • I/Os support dual voltage 3.3 V/1.8 V
  • Clock source
    • 40.0 MHz crystal with internal oscillator
    • Supports external oscillator at 40 MHz
    • Supports externally driven clock (square/sine) at 40 MHz
  • Easy hardware design
    • 0.65-mm pitch, 161-pin 10.4 mm × 10.4 mm flip chip BGA package for easy assembly and low-cost PCB design
    • Small solution size
  • Operating conditions:
    • Junction temperature range of –40°C to 105°C