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DRV2667 Piezo Haptic Driver with Boost, Digital Front End, and Internal Waveform Memory
SLOS751E
March 2013 – January 2023
DRV2667
PRODUCTION DATA
CONTENTS
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DRV2667 Piezo Haptic Driver with Boost, Digital Front End, and Internal Waveform Memory
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
6.7
Switching Characteristics
6.8
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Support for Haptic Piezo Actuators
7.3.2
Flexible Front End Interface
7.3.3
Ramp Down Behavior
7.3.4
Low Latency Startup
7.3.5
Low Power Standby Mode
7.3.6
Device Reset
7.3.7
Amplifier Gain
7.3.8
Adjustable Boost Voltage
7.3.9
Adjustable Current Limit
7.3.10
Internal Charge Pump
7.3.11
Device Protection
7.3.11.1
Thermal Protection
7.3.11.2
Overcurrent Protection
7.3.11.3
Brownout Protection
7.4
Device Functional Modes
7.4.1
FIFO Mode
7.4.1.1
Waveform Timeout
7.4.2
Direct Playback from RAM Mode
7.4.3
Waveform Synthesis Playback Mode
7.4.4
Waveform Sequencer
7.4.5
Analog Playback Mode
7.4.6
Low Voltage Operation Mode
7.5
Programming
7.5.1
Programming the Boost Voltage
7.5.2
Programming the Boost Current Limit
7.5.3
Programming the RAM
7.5.3.1
Accessing the RAM
7.5.3.2
RAM Format
7.5.3.2.1
Programming the Waveform Sequencer
7.5.4
I2C Interface
7.5.4.1
General I2C Operation
7.5.4.2
Single-Byte and Multiple-Byte Transfers
7.5.4.3
Single-Byte Write
7.5.4.4
Multiple-Byte Write and Incremental Multiple-Byte Write
7.5.4.5
Single-Byte Read
7.5.4.6
Multiple-Byte Read
7.6
Register Map
7.6.1
Address: 0x00
7.6.2
Address: 0x01
7.6.3
Address: 0x02
7.6.4
Address: 0x03
7.6.5
Address: 0x04
7.6.6
Address: 0x05
7.6.7
Address: 0x06
7.6.8
Address: 0x07
7.6.9
Address: 0x08
7.6.10
Address: 0x09
7.6.11
Address: 0x0A
7.6.12
Address: 0x0B
7.6.13
Address: 0xFF
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Inductor Selection
8.2.2.2
Piezo Actuator Selection
8.2.2.3
Boost Capacitor Selection
8.2.2.4
Bulk Capacitor Selection
8.2.3
Application Curves
8.3
Initialization Setup
8.3.1
Initialization Procedure
8.3.2
Typical Usage Examples
8.3.2.1
Single Click or Alert Example
8.3.2.2
Library Storage Example
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Receiving Notification of Documentation Updates
11.2
Community Resources
11.3
Trademarks
12
Mechanical, Packaging, and Orderable Information
IMPORTANT NOTICE
Package Options
Mechanical Data (Package|Pins)
RGP|20
MPQF126G
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slos751e_oa
slos751e_pm
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