DLPS047B September   2014  – October 2015 DLPA2005

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Data Transmission Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  DMD Regulators
      2. 7.3.2  RGB Strobe Decoder
      3. 7.3.3  LED Current Control
      4. 7.3.4  Maximum Led Currents and Efficiency Considerations
      5. 7.3.5  Calculating Inductor Peak Current
      6. 7.3.6  LED Current Accuracy
      7. 7.3.7  Transient Current Limiting
      8. 7.3.8  1.1-V Regulator (Buck Converter)
      9. 7.3.9  Measurement System
      10. 7.3.10 Protection Circuits
        1. 7.3.10.1 Thermal Warning (HOT) and Thermal Shutdown (TSD)
        2. 7.3.10.2 Low Battery Warning (BAT_LOW) and Undervoltage Lockout (UVLO)
        3. 7.3.10.3 DMD Regulator Fault (DMD_FLT)
        4. 7.3.10.4 V6V Power-Good (V6V_PGF) Fault
        5. 7.3.10.5 VLED Overvoltage (VLED_OVP) Fault
        6. 7.3.10.6 VLED Power Save Mode
        7. 7.3.10.7 V1V8 PG Failure
        8. 7.3.10.8 Interrupt Pin (INTZ)
        9. 7.3.10.9 SPI
      11. 7.3.11 Password Protected Registers
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Projector Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Typical Mobile Sensing Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
        1. 8.3.2.1 Dlpc150 System Interfaces
          1. 8.3.2.1.1 Control Interface
      3. 8.3.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • High Efficiency RGB LED/Lamp Driver With Buck-Boost DC-to-DC Converter, DMD Supplies, DPP Core Supply, 1.8-V Load Switch, and Measurement System in a Small Chip-Scale Package
  • Three Low-Impedance (30 mΩ Typical at 27°C) MOSFET Switches for Channel Selection
  • Independent, 10-Bit Current Control per Channel
  • 2.4-A Max LED Current for DLPA2005 Embedded Applications
  • DMD Regulators
    • Requires Only a Single Inductor
    • VOFS: 10 V
    • VBIAS: 18 V
    • VRST: –14 V
    • Passive Discharge to GND When Disabled
  • DPP 1.1-V Core Supply
    • Synchronous Step-Down Converter With Integrated Switching FETs
    • Supports up to 600-mA Output Current
  • VLED Buck Boost Converter
    • Power Save Mode at Light Load Current
  • Low-Impedance Load Switch
    • VIN Range from 1.8 to 3.6 V
    • Supports up to 200 mA of Current
    • Passive Discharge to GND When Disabled
  • DMD Reset Signal Generation and Power Supply Sequencing
  • 33-MHz Serial Peripheral Interface (SPI)
  • Multiplexer for Measuring Analog Signals
    • Battery Voltage
    • LED Voltage, LED Current
    • Light Sensor (for White Point Correction)
    • Internal Reference Voltage
    • External (Thermistor) Temperature Sensor
  • Monitoring and Protection Circuits
    • Hot Die Warning and Thermal
    • Low-Battery Warning
    • Programmable Battery Undervoltage Lockout (UVLO)
    • Load Switch UVLO
    • Overcurrent and Undervoltage Protection
  • DLPA2005 QFN Package
    • 48-Pin 0.4-mm Pitch
    • Die Size: 6.0 mm × 6.0 mm ± 0.15 mm

2 Applications

    DLP® Pico™ Projector

    DLP® Mobile Sensing

3 Description

DLPA2005 is a dedicated PMIC/RGB LED/Lamp driver for the DLP2010, DLP2010NIR and DLP3010 Digital Micromirror Devices (DMD) when used with a DLPC3430, DLPC3433, DLPC3435, DLCP3438, or DLPC150 digital controller. For reliable operation of these chipsets it is mandatory to use a DLPA2000 or DLPA2005.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
DLPA2005 VQFN (48) 6.00 mm × 6.00 mm ± 0.150 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.
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