SLPS453E May   2014  – January 2022 CSD23382F4

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Trademarks
    2. 6.2 Electrostatic Discharge Caution
    3. 6.3 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern
    4. 7.4 CSD23382F4 Embossed Carrier Tape Dimensions

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YJC|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Low on-resistance
  • Ultra-low Qg and Qgd
  • Ultra-small footprint (0402 case size)
    • 1.0 mm × 0.6 mm
  • Low profile
    • 0.36-mm maximum height
  • Integrated ESD protection diode
    • Rated > 2-kV HBM
    • Rated > 2-kV CDM
  • Pb terminal plating
  • Halogen free
  • RoHS compliant