SWRS196I January   2018  – February 2021 CC1352R

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 861 MHz to 1054 MHz - Receive (RX)
    11. 8.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 8.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 8.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 8.14 359 MHz to 527 MHz - Receive (RX)
    15. 8.15 359 MHz to 527 MHz - Transmit (TX) 
    16. 8.16 359 MHz to 527 MHz - PLL Phase Noise
    17. 8.17 143 MHz to 176 MHz - Receive (RX)
    18. 8.18 143 MHz to 176 MHz  - Transmit (TX) 
    19. 8.19 143 MHz to 176 MHz - PLL Phase Noise
    20. 8.20 Bluetooth Low Energy - Receive (RX)
    21. 8.21 Bluetooth Low Energy - Transmit (TX)
    22. 8.22 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    23. 8.23 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    24. 8.24 Timing and Switching Characteristics
      1. 8.24.1 Reset Timing
      2. 8.24.2 Wakeup Timing
      3. 8.24.3 Clock Specifications
        1. 8.24.3.1 48 MHz Clock Input (TCXO)
        2. 8.24.3.2 48 MHz Crystal Oscillator (XOSC_HF)
        3. 8.24.3.3 48 MHz RC Oscillator (RCOSC_HF)
        4. 8.24.3.4 2 MHz RC Oscillator (RCOSC_MF)
        5. 8.24.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 8.24.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.24.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.24.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       47
      5. 8.24.5 UART
        1. 8.24.5.1 UART Characteristics
    25. 8.25 Peripheral Characteristics
      1. 8.25.1 ADC
        1. 8.25.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.25.2 DAC
        1. 8.25.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.25.3 Temperature and Battery Monitor
        1. 8.25.3.1 Temperature Sensor
        2. 8.25.3.2 Battery Monitor
      4. 8.25.4 Comparators
        1. 8.25.4.1 Low-Power Clocked Comparator
        2. 8.25.4.2 Continuous Time Comparator
      5. 8.25.5 Current Source
        1. 8.25.5.1 Programmable Current Source
      6. 8.25.6 GPIO
        1. 8.25.6.1 GPIO DC Characteristics
    26. 8.26 Typical Characteristics
      1. 8.26.1 MCU Current
      2. 8.26.2 RX Current
      3. 8.26.3 TX Current
      4. 8.26.4 RX Performance
      5. 8.26.5 TX Performance
      6. 8.26.6 ADC Performance
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Proprietary Radio Formats
      2. 9.3.2 Bluetooth 5.2 Low Energy
      3. 9.3.3 802.15.4 (Thread, Zigbee, 6LoWPAN)
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  10. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  11. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Microcontroller
    • Powerful 48-MHz Arm® Cortex®-M4F processor
    • EEMBC CoreMark® score: 148
    • 352KB of in-system programmable flash
    • 256KB of ROM for protocols and library functions
    • 8KB of cache SRAM (alternatively available as general-purpose RAM)
    • 80KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports over-the-air (OTA) update
  • Ultra-low power sensor controller with 4KB of SRAM
    • Sample, store, and process sensor data
    • Operation independent from system CPU
    • Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth® 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
  • RoHS-compliant package
    • 7-mm × 7-mm RGZ VQFN48 (28 GPIOs)
  • Peripherals
    • Digital peripherals can be routed to any GPIO
    • 4× 32-bit or 8× 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC
      (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C and I2S
    • Real-time clock (RTC)
    • AES 128- and 256-bit cryptographic accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to 8 channels
    • Integrated temperature and battery monitor
  • External system
    • On-chip buck DC/DC converter
    • TCXO support
  • Low power
    • Wide supply voltage range: 1.8 V to 3.8 V
    • Active mode RX: 5.8 mA (3.6 V, 868 MHz), 6.9 mA (3.0 V, 2.4 GHz)
    • Active mode TX 0 dBm: 8.0 mA (3.6 V, 868 MHz), 7.1 mA (3.0 V, 2.4 GHz)
    • Active mode TX at +14 dBm: 24.9 mA (868 MHz)
    • Active mode MCU 48 MHz (CoreMark):
      2.9 mA (60 μA/MHz)
    • Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.1 μA
    • Sensor controller, active mode, 24 MHz, running infinite loop: 808 μA
    • Standby: 0.85 µA (RTC on, 80KB RAM and CPU retention)
    • Shutdown: 150 nA (wakeup on external events)
  • Radio section
    • Multi-band sub-1 GHz and 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications, and IEEE 802.15.4 PHY and MAC
    • 3-wire, 2-wire, 1-wire PTA coexistence mechanisms
    • Excellent receiver sensitivity:
      -121 dBm for SimpleLink long-range mode
      -110 dBm at 50 kbps, -105 dBm for Bluetooth 125-kbps (LE Coded PHY)
    • Output power up to +14 dBm (Sub-1 GHz) and +5 dBm (2.4 GHz) with temperature compensation
    • Suitable for systems targeting compliance with worldwide radio frequency regulations
      • ETSI EN 300 220 Receiver Category 1.5 and 2, EN 300 328, EN 303 131, EN 303 204 (Europe)
      • EN 300 440 Category 2
      • FCC CFR47 Part 15
      • ARIB STD-T108 and STD-T66
    • Wide standard support
  • Wireless protocols
    • Thread, Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), MIOTY®, Wireless M-Bus, Wi-SUN®, KNX RF, Amazon Sidewalk, proprietary systems, SimpleLink™ TI 15.4-Stack (Sub-1 GHz), and dynamic multiprotocol manager (DMM) driver.
  • Development Tools and Software