SNVSA18C April   2014  – August 2014 ADC16DX370

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Converter Performance Characteristics
    6. 6.6  Power Supply Electrical Characteristics
    7. 6.7  Analog Interface Electrical Characteristics
    8. 6.8  CLKIN, SYSREF, SYNCb Interface Electrical Characteristics
    9. 6.9  Serial Data Output Interface Electrical Characteristics
    10. 6.10 Digital Input Electrical Interface Characteristics
    11. 6.11 Timing Requirements
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Over-Range Functional Characteristics
    2. 7.2 Input Clock Divider and Clock Phase Adjustment Functional Characteristics
    3. 7.3 JESD204B Interface Functional Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Amplitude and Phase Imbalance Correction of Differential Analog Input
      2. 8.3.2  DC Offset Correction
      3. 8.3.3  Over-Range Detection
      4. 8.3.4  Input Clock Divider
      5. 8.3.5  SYSREF Offset Feature and Detection Gate
      6. 8.3.6  Sampling Instant Phase Adjustment
      7. 8.3.7  Serial Differential Output Drivers
        1. 8.3.7.1 De-Emphasis Equalization
      8. 8.3.8  ADC Core Calibration
      9. 8.3.9  Data Format
      10. 8.3.10 JESD204B Supported Features
      11. 8.3.11 Transport Layer Configuration
        1. 8.3.11.1 Lane Configuration
        2. 8.3.11.2 Frame Format
        3. 8.3.11.3 ILA Information
      12. 8.3.12 Test Pattern Sequences
      13. 8.3.13 JESD204B Link Initialization
      14. 8.3.14 SPI
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down and Sleep Modes
    5. 8.5 Register Map
      1. 8.5.1 Register Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Analog Input Considerations
        1. 9.1.1.1 Differential Analog Inputs and Full Scale Range
        2. 9.1.1.2 Analog Input Network Model
        3. 9.1.1.3 Input Bandwidth
        4. 9.1.1.4 Driving the Analog Input
        5. 9.1.1.5 Clipping and Over-Range
      2. 9.1.2 CLKIN, SYSREF, and SYNCb Input Considerations
        1. 9.1.2.1 Driving the CLKIN+ and CLKIN- Input
        2. 9.1.2.2 Clock Noise and Edge Rate
        3. 9.1.2.3 Driving the SYSREF Input
        4. 9.1.2.4 SYSREF Signaling
        5. 9.1.2.5 SYSREF Timing
        6. 9.1.2.6 Effectively Using the SYSREF Offset and Detection Gate Features
        7. 9.1.2.7 Driving the SYNCb Input
      3. 9.1.3 Output Serial Interface Considerations
        1. 9.1.3.1 Output Serial-Lane Interface
        2. 9.1.3.2 Voltage Swing and De-Emphasis Optimization
        3. 9.1.3.3 Minimizing EMI
      4. 9.1.4 JESD204B System Considerations
        1. 9.1.4.1 Frame and LMFC Clock Alignment Procedure
        2. 9.1.4.2 Link Interruption
        3. 9.1.4.3 Synchronization Requests and SYNCb Alignment in Multi-Device Systems
        4. 9.1.4.4 Clock Configuration Examples
        5. 9.1.4.5 Configuring the JESD204B Receiver
      5. 9.1.5 SPI
    2. 9.2 Typical Application
      1. 9.2.1 High-IF Sampling Receiver
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Design Procedure
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Design
    2. 10.2 Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Specification Definitions
      2. 12.1.2 JESD204B Definitions
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Resolution: 16-Bit
  • Conversion Rate: 370 MSPS
  • 1.7 VP-P Input Full Scale Range
  • Performance:
    • Input: 150 MHz, –3 dBFS
      • SNR: 69.6 dBFS
      • Noise Spectral Density: –152.3 dBFS/Hz
      • SFDR: 88 dBFS
      • Non-HD2 and Non-HD3 SPUR: –90 dBFS
  • Power Dissipation: 800 mW/channel
  • Buffered Analog Inputs
  • On-Chip Precision Reference Without External Bypassing
  • Input Sampling Clock Divider With Phase Synchronization (Divide-by- 1, 2, 4, or 8)
  • JESD204B Subclass 1 Serial Data Interface
    • Lane Rates up to 7.4 Gb/s
    • Configurable as 1- or 2-Lanes/Channel
  • Fast Over-Range Signals
  • 4-Wire, 1.2-V, 1.8-V, 2.5-V, or 3-V Compatible Serial Peripheral Interface (SPI)
  • 56-Pin WQFN Package, (8 × 8 mm, 0.5-mm Pin-Pitch)

2 Applications

  • High IF Sampling Receivers
  • Multi-Carrier Base Station Receivers
    • GSM/EDGE, CDMA2000, UMTS, LTE, WiMax
  • Diversity, Multi-Mode, and Multiband Receivers
  • Digital Pre-Distortion
  • Test and Measurement Equipment
  • Communications Instrumentation
  • Portable Instrumentation

3 Description

The ADC16DX370 device is a monolithic dual-channel high performance analog-to-digital converter capable of converting analog input signals into 16-bit digital words with a sampling rate of 370 MSPS. This converter uses a differential pipelined architecture with integrated input buffer to provide excellent dynamic performance while maintaining low power consumption.

The integrated input buffer eliminates charge kickback noise coming from the internal switched capacitor sampling circuits and eases the system-level design of the driving amplifier, anti-aliasing filter, and impedance matching. An input sampling clock divider provides integer divide ratios with configurable phase selection to simplify system clocking. An integrated low-noise voltage reference eases board level design without requiring external decoupling capacitors. The output digital data is provided through a JESD204B subclass 1 interface from a 56-pin, 8-mm × 8-mm WQFN package. A SPI is available to configure the device that is compatible with 1.2-V to 3-V logic.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
ADC16DX370 WQFN (56) 8.00 × 8.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

SPACE

1-Tone Spectrum, 150 MHz

ADC16DX370 D016_SNVSA18.gif

Output Serial Lane Eye Diagram at 7.4 Gb/s

ADC16DX370 eye_mask_7p4G_TX_snvs990.png